Datasheet Texas Instruments SN54AHCT373 — Ficha de datos

Fabricante	Texas Instruments
Serie	SN54AHCT373

Hojas de datos

Precios

Estado

Embalaje

Paramétricos

Parameters / Models	5962-9686701Q2A	5962-9686701QRA	5962-9686701QSA	SNJ54AHCT373FK	SNJ54AHCT373J	SNJ54AHCT373W
3-State Output	Yes	Yes	Yes	Yes	Yes	Yes
Bits	8	8	8	8	8	8
F @ Nom Voltage(Max), Mhz	110	110	110	110	110	110
ICC @ Nom Voltage(Max), mA	0.04	0.04	0.04	0.04	0.04	0.04
Input Type	TTL	TTL	TTL	TTL	TTL	TTL
Operating Temperature Range, C	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125
Output Drive (IOL/IOH)(Max), mA	8/-8	8/-8	8/-8	8/-8	8/-8	8/-8
Output Type	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Package Group	LCCC	CDIP	CFP	LCCC	CDIP	CFP
Package Size: mm2:W x L, PKG	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CFP)	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CFP)
Rating	Military	Military	Military	Military	Military	Military
Technology Family	AHCT	AHCT	AHCT	AHCT	AHCT	AHCT
VCC(Max), V	5.5	5.5	5.5	5.5	5.5	5.5
VCC(Min), V	4.5	4.5	4.5	4.5	4.5	4.5
tpd @ Nom Voltage(Max), ns	10.5	10.5	10.5	10.5	10.5	10.5

Plan ecológico

Notas de aplicación

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  This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
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  The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
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  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  PDF, 89 Kb, Revisión: B, Archivo publicado: jun 1, 1997
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Linea modelo

Clasificación del fabricante

• Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers