Datasheet Texas Instruments SN54ACT573 — Ficha de datos

Fabricante	Texas Instruments
Serie	SN54ACT573

Hojas de datos

Precios

Estado

Embalaje

Paramétricos

Parameters / Models	5962-87664012A	5962-8766401RA	5962-8766401SA	SNJ54ACT573FK	SNJ54ACT573J	SNJ54ACT573W
3-State Output	Yes	Yes	Yes	Yes	Yes	Yes
Bits	8	8	8	8	8	8
F @ Nom Voltage(Max), Mhz	90	90	90	90	90	90
ICC @ Nom Voltage(Max), mA	0.04	0.04	0.04	0.04	0.04	0.04
Input Type	TTL	TTL	TTL	TTL	TTL	TTL
Operating Temperature Range, C	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125
Output Drive (IOL/IOH)(Max), mA	24/-24	24/-24	24/-24	24/-24	24/-24	24/-24
Output Type	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Package Group	LCCC	CDIP	CFP	LCCC	CDIP	CFP
Package Size: mm2:W x L, PKG	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CFP)	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CFP)
Rating	Military	Military	Military	Military	Military	Military
Technology Family	ACT	ACT	ACT	ACT	ACT	ACT
VCC(Max), V	5.5	5.5	5.5	5.5	5.5	5.5
VCC(Min), V	4.5	4.5	4.5	4.5	4.5	4.5
tpd @ Nom Voltage(Max), ns	12	12	12	12	12	12

Plan ecológico

Notas de aplicación

• Descargar
  Power-Up Behavior of Clocked Devices (Rev. A)
  PDF, 34 Kb, Revisión: A, Archivo publicado: feb 6, 2015
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  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Kb, Archivo publicado: agosto 29, 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
• Descargar
  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
• Descargar
  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Kb, Archivo publicado: jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
• Descargar
  Selecting the Right Level Translation Solution (Rev. A)
  PDF, 313 Kb, Revisión: A, Archivo publicado: jun 22, 2004
  Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
• Descargar
  Designing With Logic (Rev. C)
  PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
• Descargar
  Introduction to Logic
  PDF, 93 Kb, Archivo publicado: abr 30, 2015
• Descargar
  Implications of Slow or Floating CMOS Inputs (Rev. D)
  PDF, 260 Kb, Revisión: D, Archivo publicado: jun 23, 2016
• Descargar
  CMOS Power Consumption and CPD Calculation (Rev. B)
  PDF, 89 Kb, Revisión: B, Archivo publicado: jun 1, 1997
  Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
• Descargar
  Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
  PDF, 43 Kb, Archivo publicado: abr 1, 1996
  Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

Linea modelo

Clasificación del fabricante

• Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers