Datasheet Texas Instruments 5962-8755601RA — Ficha de datos
Fabricante | Texas Instruments |
Serie | SN54ACT373 |
Numero de parte | 5962-8755601RA |
Cierres transparentes de tipo D octal con salidas de 3 estados 20-CDIP -55 a 125
Hojas de datos
SN54ACT373, SN74ACT373 datasheet
PDF, 1.4 Mb, Revisión: E, Archivo publicado: oct 8, 2002
Extracto del documento
Precios
Estado
Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) |
Disponibilidad de muestra del fabricante | No |
Embalaje
Pin | 20 |
Package Type | J |
Industry STD Term | CDIP |
JEDEC Code | R-GDIP-T |
Package QTY | 1 |
Carrier | TUBE |
Width (mm) | 6.92 |
Length (mm) | 24.2 |
Thickness (mm) | 4.57 |
Pitch (mm) | 2.54 |
Max Height (mm) | 5.08 |
Mechanical Data | Descargar |
Paramétricos
3-State Output | Yes |
Bits | 8 |
F @ Nom Voltage(Max) | 90 Mhz |
ICC @ Nom Voltage(Max) | 0.04 mA |
Input Type | TTL |
Operating Temperature Range | -55 to 125 C |
Output Drive (IOL/IOH)(Max) | 24/-24 mA |
Output Type | CMOS |
Package Group | CDIP |
Package Size: mm2:W x L | See datasheet (CDIP) PKG |
Rating | Military |
Technology Family | ACT |
VCC(Max) | 5.5 V |
VCC(Min) | 4.5 V |
tpd @ Nom Voltage(Max) | 11.5 ns |
Plan ecológico
RoHS | See ti.com |
Notas de aplicación
- Selecting the Right Level Translation Solution (Rev. A)PDF, 313 Kb, Revisión: A, Archivo publicado: jun 22, 2004
Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati - Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Kb, Archivo publicado: jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Introduction to LogicPDF, 93 Kb, Archivo publicado: abr 30, 2015
- Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple VccPDF, 43 Kb, Archivo publicado: abr 1, 1996
Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren - Power-Up Behavior of Clocked Devices (Rev. A)PDF, 34 Kb, Revisión: A, Archivo publicado: feb 6, 2015
- Designing With Logic (Rev. C)PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w - CMOS Power Consumption and CPD Calculation (Rev. B)PDF, 89 Kb, Revisión: B, Archivo publicado: jun 1, 1997
Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale - Implications of Slow or Floating CMOS Inputs (Rev. D)PDF, 260 Kb, Revisión: D, Archivo publicado: jun 23, 2016
- TI IBIS File Creation Validation and Distribution ProcessesPDF, 380 Kb, Archivo publicado: agosto 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
Linea modelo
Serie: SN54ACT373 (6)
- 5962-87556012A 5962-8755601RA 5962-8755601SA SNJ54ACT373FK SNJ54ACT373J SNJ54ACT373W
Clasificación del fabricante
- Semiconductors > Space & High Reliability > Logic Products > Flip-Flop/Latch/Registers
Otros nombres:
59628755601RA, 5962 8755601RA