Datasheet Texas Instruments MSP430G2230-EP — Ficha de datos
| Fabricante | Texas Instruments |
| Serie | MSP430G2230-EP |
Producto mejorado Microcontrolador de señal mixta de ultra baja potencia de 16 bits, 2kB Flash, 128B RAM
Hojas de datos
MSP430G2230-EP Mixed Signal Microcontroller datasheet
PDF, 997 Kb, Archivo publicado: agosto 16, 2012
Extracto del documento
Precios
Estado
| MSP430G2230QDEP | MSP430G2230QDREP | V62/12620-01XE | V62/12620-01XE-T | |
|---|---|---|---|---|
| Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) |
| Disponibilidad de muestra del fabricante | No | Sí | No | Sí |
Embalaje
| MSP430G2230QDEP | MSP430G2230QDREP | V62/12620-01XE | V62/12620-01XE-T | |
|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 |
| Pin | 8 | 8 | 8 | 8 |
| Package Type | D | D | D | D |
| Industry STD Term | SOIC | SOIC | SOIC | SOIC |
| JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G |
| Package QTY | 75 | 2500 | 2500 | 75 |
| Carrier | TUBE | LARGE T&R | LARGE T&R | TUBE |
| Device Marking | G230EP | G230EP | G230EP | G230EP |
| Width (mm) | 3.91 | 3.91 | 3.91 | 3.91 |
| Length (mm) | 4.9 | 4.9 | 4.9 | 4.9 |
| Thickness (mm) | 1.58 | 1.58 | 1.58 | 1.58 |
| Pitch (mm) | 1.27 | 1.27 | 1.27 | 1.27 |
| Max Height (mm) | 1.75 | 1.75 | 1.75 | 1.75 |
| Mechanical Data | Descargar | Descargar | Descargar | Descargar |
Paramétricos
| Parameters / Models | MSP430G2230QDEP | MSP430G2230QDREP | V62/12620-01XE | V62/12620-01XE-T |
|---|---|---|---|---|
| ADC | ADC10 - 4ch | ADC10 - 4ch | ADC10 - 4ch | ADC10 - 4ch |
| AES | N/A | N/A | N/A | N/A |
| Active Power, uA/MHz | 220 | 220 | 220 | 220 |
| Additional Features | Watchdog,Temp Sensor,Brown Out Reset | Watchdog,Temp Sensor,Brown Out Reset | Watchdog,Temp Sensor,Brown Out Reset | Watchdog,Temp Sensor,Brown Out Reset |
| BSL | I2C | I2C | I2C | I2C |
| CPU | MSP430 | MSP430 | MSP430 | MSP430 |
| DMA | 1 | 1 | 1 | 1 |
| Frequency, MHz | 16 | 16 | 16 | 16 |
| GPIO | 4 | 4 | 4 | 4 |
| I2C | 1 | 1 | 1 | 1 |
| Max VCC | 3.6 | 3.6 | 3.6 | 3.6 |
| Min VCC | 1.8 | 1.8 | 1.8 | 1.8 |
| Multiplier | N/A | N/A | N/A | N/A |
| Non-volatile Memory, KB | 2 | 2 | 2 | 2 |
| Operating Temperature Range, C | -40 to 125 | -40 to 125 | -40 to 125 | -40 to 125 |
| Package Group | SOIC | SOIC | SOIC | SOIC |
| Package Size: mm2:W x L, PKG | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) |
| RAM, KB | 0.125 | 0.125 | 0.125 | 0.125 |
| Rating | HiRel Enhanced Product | HiRel Enhanced Product | HiRel Enhanced Product | HiRel Enhanced Product |
| SPI | 1 | 1 | 1 | 1 |
| Special I/O | N/A | N/A | N/A | N/A |
| Standby Power, LPM3-uA | 0.5 | 0.5 | 0.5 | 0.5 |
| Timers - 16-bit | 1 | 1 | 1 | 1 |
| Wakeup Time, us | 1 | 1 | 1 | 1 |
Plan ecológico
| MSP430G2230QDEP | MSP430G2230QDREP | V62/12620-01XE | V62/12620-01XE-T | |
|---|---|---|---|---|
| RoHS | Obediente | Obediente | Obediente | Obediente |
Notas de aplicación
- Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)PDF, 237 Kb, Revisión: E, Archivo publicado: mayo 4, 2018
This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430
Linea modelo
Serie: MSP430G2230-EP (4)
Clasificación del fabricante
- Semiconductors> Space & High Reliability> Microcontroller> Low Power MCU> MSP430 MCU