Datasheet Texas Instruments LMZ31506 — Ficha de datos

Fabricante	Texas Instruments
Serie	LMZ31506

Hojas de datos

Precios

Estado

Embalaje

Paramétricos

Parameters / Models	LMZ31506RUQR	LMZ31506RUQT
Iout(Max), A	6	6
Operating Temperature Range, C	-40 to 85	-40 to 85
Package Size: mm2:W x L, PKG	47B1QFN: 135 mm2: 9 x 15(B1QFN)	47B1QFN: 135 mm2: 9 x 15(B1QFN)
Package Type	QFN	QFN
Regulated Outputs	1	1
Soft Start	Adjustable	Adjustable
Special Features	Current Sharing,EMI Tested,Enable,Frequency Synchronization,Power Good,Remote Sense,Tracking	Current Sharing,EMI Tested,Enable,Frequency Synchronization,Power Good,Remote Sense,Tracking
Switching Frequency(Max), kHz	780	780
Switching Frequency(Min), kHz	250	250
Switching Frequency(Typ), kHz	500	500
Vin(Max), V	14.5	14.5
Vin(Min), V	2.95	2.95
Vout(Max), V	5.5	5.5
Vout(Min), V	0.6	0.6

Plan ecológico

Notas de aplicación

• Descargar
  LMZ31506 Parallel Operation
  PDF, 315 Kb, Archivo publicado: jul 2, 2013
  The LMZ31506 is a 2.95-V to 14.5-V input, 6-A output, integrated power solution which integrates the PWM controller, power MOSFETs, inductor and passives in a low-profile, QFN package. For applications requiring greater than 6 A, it is possible to parallel two or more LMZ31506 devices by following the recommendations in this paper.
• Descargar
  Powering LMZ3 SIMPLE SWITCHER Power Modules From 3.3 V
  PDF, 38 Kb, Archivo publicado: jul 2, 2013
  LMZ31503 Powering LMZ3 SIMPLE SWITCHERВ® Power Modules from 3.3V
• Descargar
  Adjusting LMZ3 Output Voltage with LM10010/1
  PDF, 87 Kb, Archivo publicado: feb 11, 2014
  ThisapplicationnoteoutlinesthemethodstopairanLMZ3powermodulewithanLM10010/1VIDvoltageprogrammertoadjusttheoutputvoltage.TheLMZ3powermoduleisaneasy-to-useintegratedpowersolutionwhichcombinesaDC/DCconverterwithpowerMOSFETs,ashieldedinductor,andpassivecomponentsintoalowprofileQFNpackage,whilest
• Descargar
  Working With QFN Power Modules (Rev. A)
  PDF, 1.7 Mb, Revisión: A, Archivo publicado: jun 8, 2017
  TexasInstrumentsQuadFlatpackNo-lead(QFN)powermodulesallowfor boardminiaturization,and holdseveraladvantagesoverotherpowermodulepackages.The QFNpackageshavehigherpowerdensity,asmallerroutingarea,improvedthermalperformance,and improvedelectricalparasitics.Additionally,theabsenceof externalleadseliminatesbent-leadconc
• Descargar
  Soldering Requirements for BQFN Packages (Rev. B)
  PDF, 737 Kb, Revisión: B, Archivo publicado: jun 8, 2017
  This documentoutlinesthe solderingrequirementsfor the TPS84and LMZ3devicefamilies
• Descargar
  Uninterruptible Synchronization Clock Circuit
  PDF, 74 Kb, Archivo publicado: nov 22, 2013
• Descargar
  Understanding and Applying Current-Mode Control Theory
  PDF, 409 Kb, Archivo publicado: agosto 19, 2007
• Descargar
  AN-643 EMI/RFI Board Design (Rev. B)
  PDF, 742 Kb, Revisión: B, Archivo publicado: mayo 3, 2004
  Application Note 643 EMI/RFI Board Design
• Descargar
  AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
  PDF, 82 Kb, Revisión: C, Archivo publicado: abr 23, 2013
  When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
• Descargar
  AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
  PDF, 2.7 Mb, Revisión: A, Archivo publicado: abr 23, 2013
  This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
• Descargar
  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, Revisión: B, Archivo publicado: abr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
• Descargar
  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, Revisión: A, Archivo publicado: abr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
• Descargar
  AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
  PDF, 374 Kb, Revisión: C, Archivo publicado: abr 23, 2013
  This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
• Descargar
  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, Revisión: C, Archivo publicado: abr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
• Descargar
  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, Revisión: C, Archivo publicado: abr 19, 2016
• Descargar
  QFN and SON PCB Attachment (Rev. B)
  PDF, 821 Kb, Revisión: B, Archivo publicado: agosto 24, 2018
• Descargar
  Input and Output Capacitor Selection
  PDF, 219 Kb, Archivo publicado: sept 19, 2005

Linea modelo

Clasificación del fabricante

• Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module