Datasheet Texas Instruments LMZ23608 — Ficha de datos
| Fabricante | Texas Instruments |
| Serie | LMZ23608 |
Módulo de alimentación 8A SIMPLE SWITCHER® con voltaje de entrada máximo de 36 V y corriente compartida
Hojas de datos
LMZ23608 8-A SIMPLE SWITCHERВ® Power Module With 36-V Maximum Input Voltage and Current Sharing datasheet
PDF, 1.5 Mb, Revisión: G, Archivo publicado: agosto 31, 2015
Extracto del documento
Precios
Estado
| LMZ23608TZ/NOPB | LMZ23608TZE/NOPB | |
|---|---|---|
| Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) |
| Disponibilidad de muestra del fabricante | Sí | Sí |
Embalaje
| LMZ23608TZ/NOPB | LMZ23608TZE/NOPB | |
|---|---|---|
| N | 1 | 2 |
| Pin | 11 | 11 |
| Package Type | NDY | NDY |
| Industry STD Term | TO-PMOD | TO-PMOD |
| JEDEC Code | S-MSFM-P | S-MSFM-P |
| Package QTY | 32 | 250 |
| Carrier | TUBE | SMALL T&R |
| Device Marking | LMZ23608 | LMZ23608 |
| Width (mm) | 15 | 15 |
| Length (mm) | 15 | 15 |
| Thickness (mm) | 5.9 | 5.9 |
| Pitch (mm) | 1.27 | 1.27 |
| Max Height (mm) | 6.13 | 6.13 |
| Mechanical Data | Descargar | Descargar |
Paramétricos
| Parameters / Models | LMZ23608TZ/NOPB | LMZ23608TZE/NOPB |
|---|---|---|
| Iout(Max), A | 8 | 8 |
| Iq(Typ), mA | 3 | 3 |
| Operating Temperature Range, C | -40 to 85 | -40 to 85 |
| Package Size: mm2:W x L, PKG | See datasheet (PFM) | See datasheet (PFM) |
| Package Type | Leaded | Leaded |
| Regulated Outputs | 1 | 1 |
| Soft Start | Adjustable | Adjustable |
| Special Features | Current Sharing,EMI Tested,Enable,Frequency Synchronization,Tracking | Current Sharing,EMI Tested,Enable,Frequency Synchronization,Tracking |
| Switching Frequency(Max), kHz | 600 | 600 |
| Switching Frequency(Min), kHz | 350 | 350 |
| Switching Frequency(Typ), kHz | 359 | 359 |
| Vin(Max), V | 36 | 36 |
| Vin(Min), V | 6 | 6 |
| Vout(Max), V | 6 | 6 |
| Vout(Min), V | 0.8 | 0.8 |
Plan ecológico
| LMZ23608TZ/NOPB | LMZ23608TZE/NOPB | |
|---|---|---|
| RoHS | Desobediente | Desobediente |
Notas de aplicación
- Understanding and Applying Current-Mode Control TheoryPDF, 409 Kb, Archivo publicado: agosto 19, 2007
- AN-643 EMI/RFI Board Design (Rev. B)PDF, 742 Kb, Revisión: B, Archivo publicado: mayo 3, 2004
Application Note 643 EMI/RFI Board Design - Uninterruptible Synchronization Clock CircuitPDF, 74 Kb, Archivo publicado: nov 22, 2013
- Input and Output Capacitor SelectionPDF, 219 Kb, Archivo publicado: sept 19, 2005
- AN-2145 Power Considerations for SDI Products (Rev. B)PDF, 63 Kb, Revisión: B, Archivo publicado: abr 26, 2013
This application report discusses the issues and trade-offs that VCC ripple has on the performance of SDI components. - AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)PDF, 3.6 Mb, Revisión: A, Archivo publicado: abr 23, 2013
This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor. - Design Summary LMZ1xxx and LMZ2xxx Power Module Family (Rev. B)PDF, 996 Kb, Revisión: B, Archivo publicado: enero 20, 2016
- AN-2026 Effect of PCB Design on Thermal Performance of SIMPLE SWITCHER Modules (Rev. A)PDF, 455 Kb, Revisión: A, Archivo publicado: abr 23, 2013
This application report focuses on the low current modules that come in a 7 lead, 10.16 x 4.57 x 9.81 mmpackage. - AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)PDF, 2.7 Mb, Revisión: A, Archivo publicado: abr 23, 2013
This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time. - Semiconductor and IC Package Thermal Metrics (Rev. C)PDF, 201 Kb, Revisión: C, Archivo publicado: abr 19, 2016
- AN-2020 Thermal Design By Insight, Not Hindsight (Rev. C)PDF, 568 Kb, Revisión: C, Archivo publicado: abr 23, 2013
This application report provides an in-depth discussion of thermal design. - AN-2078 PCB Layout for Texas Instruments SIMPLE SWITCHER Power Modules (Rev. A)PDF, 1.1 Mb, Revisión: A, Archivo publicado: abr 23, 2013
This application report discusses the best PCB layout methods, practices and techniques to maximize themodule’s performance. - AN-2052 Texas Instruments SIMPLE SWITCHER Power Modules and EMI (Rev. C)PDF, 99 Kb, Revisión: C, Archivo publicado: abr 23, 2013
While the principles discussed in this application report apply more broadly to power design, we will focuson DC to DC convertor design given its broad application. It affects virtually every hardware engineer whoat some point has to design a power convertor. In this application report we will consider two commontrade-offs related to low EMI design; thermal performance and EMI and also solut - AN-2146 Power Design for SDI and Other Noise-Sensitive Devices (Rev. A)PDF, 1.4 Mb, Revisión: A, Archivo publicado: abr 26, 2013
This application report discusses various solutions for meeting the power requirements of serial digital interface (SDI) video components. - AN-2027 Inverting Application for the LMZ14203 SIMPLE SWITCHER Power Module (Rev. A)PDF, 244 Kb, Revisión: A, Archivo publicado: mayo 6, 2013
This application report illustrates how to apply the LMZ14203 integrated buck module into the buck-boost configuration such that a positive input voltage can be used to create a regulated negative output voltage. - AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)PDF, 82 Kb, Revisión: C, Archivo publicado: abr 23, 2013
When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current - AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)PDF, 374 Kb, Revisión: C, Archivo publicado: abr 23, 2013
This application report provides SIMPLE SWITCHER™ PCB layout guidelines. - AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)PDF, 2.5 Mb, Revisión: C, Archivo publicado: abr 24, 2013
Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti - AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)PDF, 9.2 Mb, Revisión: B, Archivo publicado: abr 23, 2013
This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
Linea modelo
Serie: LMZ23608 (2)
Clasificación del fabricante
- Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module