Datasheet Texas Instruments LMR12007 — Ficha de datos

FabricanteTexas Instruments
SerieLMR12007
Datasheet Texas Instruments LMR12007

Regulador de CC / CC reductor de carga de 750 mA en paquete SOT23 delgado

Hojas de datos

LMR12007 Thin SOT23 750mA Load Step-Down DC-DC Regulator datasheet
PDF, 1.4 Mb, Archivo publicado: sept 6, 2013
Extracto del documento

Precios

Estado

LMR12007XMKLMR12007XMKXLMR12007YMKLMR12007YMKX
Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNoNo

Embalaje

LMR12007XMKLMR12007XMKXLMR12007YMKLMR12007YMKX
N1234
Pin6666
Package TypeDDCDDCDDCDDC
Industry STD TermSOT-23-THINSOT-23-THINSOT-23-THINSOT-23-THIN
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY1000300010003000
CarrierLARGE T&RLARGE T&RLARGE T&RLARGE T&R
Device MarkingSP1BSP1BSP2BSP2B
Width (mm)1.61.61.61.6
Length (mm)2.92.92.92.9
Thickness (mm).87.87.87.87
Pitch (mm).95.95.95.95
Max Height (mm)1.11.11.11.1
Mechanical DataDescargarDescargarDescargarDescargar

Paramétricos

Parameters / ModelsLMR12007XMK
LMR12007XMK
LMR12007XMKX
LMR12007XMKX
LMR12007YMK
LMR12007YMK
LMR12007YMKX
LMR12007YMKX
Control ModeCurrent ModeCurrent ModeCurrent ModeCurrent Mode
Duty Cycle(Max), %96969696
Iout(Max), A0.750.750.750.75
Iq(Typ), mA1.51.51.51.5
Operating Temperature Range, C-40 to 125-40 to 125-40 to 125-40 to 125
Package GroupSOT-23-THINSOT-23-THINSOT-23-THINSOT-23-THIN
RatingCatalogCatalogCatalogCatalog
Regulated Outputs1111
Special FeaturesEnableEnableEnableEnable
Switching Frequency(Max), kHz1600160016001600
Switching Frequency(Min), kHz550550550550
TypeConverterConverterConverterConverter
Vin(Max), V18181818
Vin(Min), V3333
Vout(Max), V16161616
Vout(Min), V1.251.251.251.25

Plan ecológico

LMR12007XMKLMR12007XMKXLMR12007YMKLMR12007YMKX
RoHSObedienteObedienteObedienteObediente

Notas de aplicación

  • AN-1197 Selecting Inductors for Buck Converters (Rev. B)
    PDF, 558 Kb, Revisión: B, Archivo publicado: abr 23, 2013
    This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
  • AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
    PDF, 1.4 Mb, Revisión: A, Archivo publicado: abr 23, 2013
    This application note provides thermal power analysis techniques for analyzing the power IC.
  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Kb, Revisión: B, Archivo publicado: mayo 3, 2004
    Application Note 643 EMI/RFI Board Design
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Kb, Revisión: C, Archivo publicado: abr 23, 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Mb, Revisión: A, Archivo publicado: abr 23, 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Mb, Revisión: A, Archivo publicado: abr 23, 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Mb, Revisión: B, Archivo publicado: abr 23, 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Kb, Revisión: C, Archivo publicado: abr 23, 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Mb, Revisión: C, Archivo publicado: abr 24, 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, Revisión: C, Archivo publicado: abr 19, 2016
  • Input and Output Capacitor Selection
    PDF, 219 Kb, Archivo publicado: sept 19, 2005

Linea modelo

Clasificación del fabricante

  • Semiconductors> Power Management> Non-isolated DC/DC Switching Regulator> Step-Down (Buck)> Buck Converter (Integrated Switch)