Datasheet Texas Instruments ISO7842 — Ficha de datos
Fabricante | Texas Instruments |
Serie | ISO7842 |
5.7 kVrms, 100 Mbps, Aislador digital reforzado de 2 canales 2/2
Hojas de datos
ISO7842x High-Performance, 8000-VPK Reinforced Quad-Channel Digital Isolator datasheet
PDF, 1.4 Mb, Revisión: G, Archivo publicado: marzo 2, 2017
Extracto del documento
Precios
Estado
ISO7842DW | ISO7842DWR | ISO7842DWW | ISO7842DWWR | ISO7842FDW | ISO7842FDWR | ISO7842FDWW | ISO7842FDWWR | |
---|---|---|---|---|---|---|---|---|
Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) |
Disponibilidad de muestra del fabricante | Sí | Sí | Sí | No | Sí | No | No | No |
Embalaje
ISO7842DW | ISO7842DWR | ISO7842DWW | ISO7842DWWR | ISO7842FDW | ISO7842FDWR | ISO7842FDWW | ISO7842FDWWR | |
---|---|---|---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 |
Pin | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Package Type | DW | DW | DWW | DWW | DW | DW | DWW | DWW |
Industry STD Term | SOIC | SOIC | SOIC | SOIC | ||||
JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | ||||
Package QTY | 40 | 2000 | 45 | 1000 | 40 | 2000 | 45 | 1000 |
Carrier | TUBE | LARGE T&R | TUBE | LARGE T&R | TUBE | LARGE T&R | TUBE | LARGE T&R |
Device Marking | ISO7842 | ISO7842 | ISO7842 | ISO7842 | ISO7842F | ISO7842F | ISO7842F | ISO7842F |
Width (mm) | 7.5 | 7.5 | 14 | 14 | 7.5 | 7.5 | 14 | 14 |
Length (mm) | 10.3 | 10.3 | 10.3 | 10.3 | 10.3 | 10.3 | 10.3 | 10.3 |
Thickness (mm) | 2.35 | 2.35 | 2.45 | 2.45 | 2.35 | 2.35 | 2.45 | 2.45 |
Pitch (mm) | 1.27 | 1.27 | 1.27 | 1.27 | ||||
Max Height (mm) | 2.65 | 2.65 | 2.65 | 2.65 | ||||
Mechanical Data | Descargar | Descargar | Descargar | Descargar | Descargar | Descargar | Descargar | Descargar |
Paramétricos
Parameters / Models | ISO7842DW | ISO7842DWR | ISO7842DWW | ISO7842DWWR | ISO7842FDW | ISO7842FDWR | ISO7842FDWW | ISO7842FDWWR |
---|---|---|---|---|---|---|---|---|
Data Rate(Max), Mbps | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Default Output | High | High | High | High | Low | Low | Low | Low |
Forward/Reverse Channels | 2/2 | 2/2 | 2/2 | 2/2 | 2/2 | 2/2 | 2/2 | 2/2 |
Integrated Isolated Power | No | No | No | No | No | No | No | No |
Isolation Rating, Vrms | 5700 | 5700 | 5700 | 5700 | 5700 | 5700 | 5700 | 5700 |
Number of Channels | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Operating Temperature Range, C | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 |
Package Group | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
Package Size: mm2:W x L, PKG | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) |
Propagation Delay, ns | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 |
Propagation Delay(Typ), ns | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 |
Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
Surge Voltage Rating, Vpk | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
VCC(Max), V | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 |
VCC(Min), V | 2.25 | 2.25 | 2.25 | 2.25 | 2.25 | 2.25 | 2.25 | 2.25 |
Plan ecológico
ISO7842DW | ISO7842DWR | ISO7842DWW | ISO7842DWWR | ISO7842FDW | ISO7842FDWR | ISO7842FDWW | ISO7842FDWWR | |
---|---|---|---|---|---|---|---|---|
RoHS | Obediente | Obediente | Obediente | Obediente | Obediente | Obediente | Obediente | Obediente |
Notas de aplicación
- Pushing the envelope with high-performance digital-isolation technologyPDF, 147 Kb, Archivo publicado: oct 30, 2015
- 4Q 2015 Analog Applications JournalPDF, 1.6 Mb, Archivo publicado: oct 30, 2015
- Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Mb, Archivo publicado: mayo 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a - Isolation GlossaryPDF, 52 Kb, Archivo publicado: oct 27, 2014
- Digital Isolator Design Guide (Rev. A)PDF, 487 Kb, Revisión: A, Archivo publicado: nov 4, 2014
Linea modelo
Serie: ISO7842 (8)
Clasificación del fabricante
- Semiconductors> Isolation> Digital Isolators