Datasheet Texas Instruments ISO7330-Q1 — Ficha de datos

Fabricante	Texas Instruments
Serie	ISO7330-Q1

Aislador digital automotriz, de baja potencia, triple canal 3/0

Hojas de datos

PDF, 1.3 Mb, Archivo publicado: nov 16, 2015

Extracto del documento

	ISO7330CQDWQ1	ISO7330CQDWRQ1	ISO7330FCQDWQ1	ISO7330FCQDWRQ1
Estado del ciclo de vida	Activo (Recomendado para nuevos diseños)	Activo (Recomendado para nuevos diseños)	Activo (Recomendado para nuevos diseños)	Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricante	Sí	Sí	No	No

	ISO7330CQDWQ1	ISO7330CQDWRQ1	ISO7330FCQDWQ1	ISO7330FCQDWRQ1
N	1	2	3	4
Pin	16	16	16	16
Package Type	DW	DW	DW	DW
Industry STD Term	SOIC	SOIC	SOIC	SOIC
JEDEC Code	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G
Package QTY	40	2000	40	2000
Carrier	TUBE	LARGE T&R	TUBE	LARGE T&R
Device Marking	ISO7330CQ	ISO7330CQ	ISO7330FCQ	ISO7330FCQ
Width (mm)	7.5	7.5	7.5	7.5
Length (mm)	10.3	10.3	10.3	10.3
Thickness (mm)	2.35	2.35	2.35	2.35
Pitch (mm)	1.27	1.27	1.27	1.27
Max Height (mm)	2.65	2.65	2.65	2.65
Mechanical Data	Descargar	Descargar	Descargar	Descargar

Parameters / Models	ISO7330CQDWQ1	ISO7330CQDWRQ1	ISO7330FCQDWQ1	ISO7330FCQDWRQ1
Data Rate(Max), Mbps	25	25	25	25
Default Output	High	High	Low	Low
Forward/Reverse Channels	3/0	3/0	3/0	3/0
Integrated Isolated Power	No	No	No	No
Isolation Rating, Vrms	3000	3000	3000	3000
Number of Channels	3	3	3	3
Operating Temperature Range, C	-40 to 125	-40 to 125	-40 to 125	-40 to 125
Package Group	SOIC	SOIC	SOIC	SOIC
Package Size: mm2:W x L, PKG	16SOIC: 106 mm2: 10.3 x 10.3(SOIC)	16SOIC: 106 mm2: 10.3 x 10.3(SOIC)	16SOIC: 106 mm2: 10.3 x 10.3(SOIC)	16SOIC: 106 mm2: 10.3 x 10.3(SOIC)
Propagation Delay, ns	31	31	31	31
Propagation Delay(Typ), ns	31	31	31	31
Rating	Automotive	Automotive	Automotive	Automotive
Surge Voltage Rating, Vpk	6000	6000	6000	6000
VCC(Max), V	5	5	5	5
VCC(Min), V	3.3	3.3	3.3	3.3

	ISO7330CQDWQ1	ISO7330CQDWRQ1	ISO7330FCQDWQ1	ISO7330FCQDWRQ1
RoHS	Obediente	Obediente	Obediente	Obediente

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Shelf-Life Evaluation of Lead-Free Component Finishes
PDF, 1.3 Mb, Archivo publicado: mayo 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a

Serie: ISO7330-Q1 (4)