Datasheet Texas Instruments ISO5851DWR — Ficha de datos
| Fabricante | Texas Instruments |
| Serie | ISO5851 |
| Numero de parte | ISO5851DWR |
Controlador de puerta IGBT aislado reforzado con abrazadera alta CMTI y Miller 16-SOIC -40 a 125
Hojas de datos
ISO5851 High-CMTI 2.5-A and 5-A Isolated IGBT, MOSFET Gate Driver With Active Protection Features datasheet
PDF, 1.5 Mb, Revisión: B, Archivo publicado: enero 16, 2017
Extracto del documento
Precios
Estado
| Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) |
| Disponibilidad de muestra del fabricante | No |
Embalaje
| Pin | 16 |
| Package Type | DW |
| Industry STD Term | SOIC |
| JEDEC Code | R-PDSO-G |
| Package QTY | 2000 |
| Carrier | LARGE T&R |
| Device Marking | ISO5851 |
| Width (mm) | 7.5 |
| Length (mm) | 10.3 |
| Thickness (mm) | 2.35 |
| Pitch (mm) | 1.27 |
| Max Height (mm) | 2.65 |
| Mechanical Data | Descargar |
Paramétricos
| DIN V VDE V 0884-10 Working Voltage | 2121 Vpk |
| DIN V VDE V 0884-10 Transient Overvoltage Rating | 8000 Vpk |
| Enable/Disable Function | N/A |
| Input VCC(Max) | 5.5 V |
| Input VCC(Min) | 3 V |
| Isolation Rating | 5700 Vrms |
| Number of Channels | 1 |
| Operating Temperature Range | -40 to 125 C |
| Output VCC/VDD(Max) | 30 V |
| Output VCC/VDD(Min) | 15 V |
| Package Group | SOIC |
| Package Size: mm2:W x L | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) PKG |
| Peak Output Current | 5 A |
| Power Switch | IGBT,SiCFET |
| Prop Delay | 76 ns |
| Prop Delay(Max) | 110 ns |
Plan ecológico
| RoHS | Obediente |
Kits de diseño y Módulos de evaluación
- Evaluation Modules & Boards: ISO5851EVM
ISO5851 Evaluation Module (EVM)
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
Notas de aplicación
- Common-mode transient immunity for isolated gate driversPDF, 152 Kb, Archivo publicado: oct 30, 2015
- Pushing the envelope with high-performance digital-isolation technologyPDF, 147 Kb, Archivo publicado: oct 30, 2015
- Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Mb, Archivo publicado: mayo 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a - 4Q 2015 Analog Applications JournalPDF, 1.6 Mb, Archivo publicado: oct 30, 2015
- Isolation GlossaryPDF, 52 Kb, Archivo publicado: oct 27, 2014
- Digital Isolator Design Guide (Rev. A)PDF, 487 Kb, Revisión: A, Archivo publicado: nov 4, 2014
Linea modelo
Clasificación del fabricante
- Semiconductors > Isolation > Isolated Gate Driver