Datasheet Texas Instruments 5962-9221802MRA — Ficha de datos

FabricanteTexas Instruments
SerieCY54FCT374T
Numero de parte5962-9221802MRA
Datasheet Texas Instruments 5962-9221802MRA

Registros octales de tipo D con salidas de 3 estados 20-CDIP -55 a 125

Hojas de datos

8-Bit Registers With 3-State Outputs datasheet
PDF, 692 Kb, Revisión: A, Archivo publicado: oct 1, 2001
Extracto del documento

Precios

Estado

Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNo

Embalaje

Pin20
Package TypeJ
Industry STD TermCDIP
JEDEC CodeR-GDIP-T
Package QTY1
CarrierTUBE
Width (mm)6.92
Length (mm)24.2
Thickness (mm)4.57
Pitch (mm)2.54
Max Height (mm)5.08
Mechanical DataDescargar

Paramétricos

3-State OutputYes
Bits8
F @ Nom Voltage(Max)70 Mhz
ICC @ Nom Voltage(Max)0.2 mA
Input TypeTTL
Operating Temperature Range-55 to 125 C
Output Drive (IOL/IOH)(Max)64/-32 mA
Output TypeCMOS
Package GroupCDIP
Package Size: mm2:W x LSee datasheet (CDIP) PKG
RatingMilitary
Technology FamilyFCT
VCC(Max)5.25 V
VCC(Min)4.75 V
tpd @ Nom Voltage(Max)11 ns

Plan ecológico

RoHSSee ti.com

Notas de aplicación

  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, Revisión: A, Archivo publicado: jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Archivo publicado: jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Introduction to Logic
    PDF, 93 Kb, Archivo publicado: abr 30, 2015
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Kb, Revisión: A, Archivo publicado: feb 6, 2015

Linea modelo

Clasificación del fabricante

  • Semiconductors > Space & High Reliability > Logic Products > Flip-Flop/Latch/Registers

Otros nombres:

59629221802MRA, 5962 9221802MRA