Datasheet Texas Instruments CY29FCT520T — Ficha de datos
| Fabricante | Texas Instruments |
| Serie | CY29FCT520T |
Registro de tubería multinivel de 8 bits
Hojas de datos
Multilevel Pipeline Register With 3-State Outputs datasheet
PDF, 205 Kb, Revisión: C, Archivo publicado: nov 2, 2001
Extracto del documento
Precios
Estado
| CY29FCT520ATSOC | CY29FCT520BTSOC | CY29FCT520CTSOCE4 | CY29FCT520CTSOCG4 | |
|---|---|---|---|---|
| Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) |
| Disponibilidad de muestra del fabricante | No | No | No | No |
Embalaje
| CY29FCT520ATSOC | CY29FCT520BTSOC | CY29FCT520CTSOCE4 | CY29FCT520CTSOCG4 | |
|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 |
| Pin | 24 | 24 | 24 | 24 |
| Package Type | DW | DW | DW | DW |
| Industry STD Term | SOIC | SOIC | SOIC | SOIC |
| JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G |
| Package QTY | 25 | 25 | ||
| Carrier | TUBE | TUBE | ||
| Device Marking | 29FCT520A | 29FCT520B | ||
| Width (mm) | 7.5 | 7.5 | 7.5 | 7.5 |
| Length (mm) | 15.4 | 15.4 | 15.4 | 15.4 |
| Thickness (mm) | 2.35 | 2.35 | 2.35 | 2.35 |
| Pitch (mm) | 1.27 | 1.27 | 1.27 | 1.27 |
| Max Height (mm) | 2.65 | 2.65 | 2.65 | 2.65 |
| Mechanical Data | Descargar | Descargar | Descargar | Descargar |
Plan ecológico
| CY29FCT520ATSOC | CY29FCT520BTSOC | CY29FCT520CTSOCE4 | CY29FCT520CTSOCG4 | |
|---|---|---|---|---|
| RoHS | Obediente | Obediente | Desobediente | Desobediente |
| Pb gratis | No | No |
Notas de aplicación
- Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Kb, Archivo publicado: jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Selecting the Right Level Translation Solution (Rev. A)PDF, 313 Kb, Revisión: A, Archivo publicado: jun 22, 2004
Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
Linea modelo
Serie: CY29FCT520T (4)
Clasificación del fabricante
- Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers