Data sheet acquired from Harris Semiconductor
SCHS101C – Revised September 2003 The CD40117B types are supplied in 14-lead dual-in-line plastic
packages (E suffix), 14-lead small-outline packages (M, MT, M96,
and NSR suffixes), and 14-lead thin shrink small-outline
packages (PW and PWR suffixes). Copyright пЈ© 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 24-Sep-2015 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking
(4/5) CD40117BE ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD40117BE CD40117BEE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD40117BE (1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan -The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) -please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between …
