Datasheet Texas Instruments AM5K2E02 — Ficha de datos
Fabricante | Texas Instruments |
Serie | AM5K2E02 |
Multi-core ARM KeyStone II System-on-Chip (SoC)
Hojas de datos
AM5K2E04/02 Multicore ARM KeyStone II System-on-Chip (SoC) datasheet
PDF, 1.8 Mb, Revisión: D, Archivo publicado: marzo 11, 2015
Extracto del documento
Precios
Estado
AM5K2E02ABD25 | AM5K2E02ABD4 | AM5K2E02ABDA25 | AM5K2E02ABDA4 | AM5K2E02XABD25 | |
---|---|---|---|---|---|
Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) |
Disponibilidad de muestra del fabricante | No | No | No | No | No |
Embalaje
AM5K2E02ABD25 | AM5K2E02ABD4 | AM5K2E02ABDA25 | AM5K2E02ABDA4 | AM5K2E02XABD25 | |
---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 |
Pin | 1089 | 1089 | 1089 | 1089 | 1089 |
Package Type | ABD | ABD | ABD | ABD | ABD |
Package QTY | 40 | 40 | 1 | 40 | 40 |
Carrier | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | |||
Device Marking | @2012 TI | @2012 TI | AM5K2E02ABD | A1.4GHZ | AM5K2E02XABD |
Width (mm) | 27 | 27 | 27 | 27 | 27 |
Length (mm) | 27 | 27 | 27 | 27 | 27 |
Thickness (mm) | 2.98 | 2.98 | 2.98 | 2.98 | 2.98 |
Mechanical Data | Descargar | Descargar | Descargar | Descargar | Descargar |
Paramétricos
Parameters / Models | AM5K2E02ABD25 | AM5K2E02ABD4 | AM5K2E02ABDA25 | AM5K2E02ABDA4 | AM5K2E02XABD25 |
---|---|---|---|---|---|
ARM CPU | 2 ARM Cortex-A15 | 2 ARM Cortex-A15 | 2 ARM Cortex-A15 | 2 ARM Cortex-A15 | 2 ARM Cortex-A15 |
ARM MHz, Max. | 1250,1400 | 1250,1400 | 1250,1400 | 1250,1400 | 1250,1400 |
Applications | Industrial | Industrial | Industrial | Industrial | Industrial |
DRAM | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L |
EMAC | 8-Port 1Gb Switch | 8-Port 1Gb Switch | 8-Port 1Gb Switch | 8-Port 1Gb Switch | 8-Port 1Gb Switch |
I2C | 3 | 3 | 3 | 3 | 3 |
On-Chip L2 Cache | 4096 KB (ARM Cluster) | 4096 KB (ARM Cluster) | 4096 KB (ARM Cluster) | 4096 KB (ARM Cluster) | 4096 KB (ARM Cluster) |
Operating Systems | SYS/BIOS,Linux,VxWorks,Integrity | SYS/BIOS,Linux,VxWorks,Integrity | SYS/BIOS,Linux,VxWorks,Integrity | SYS/BIOS,Linux,VxWorks,Integrity | SYS/BIOS,Linux,VxWorks,Integrity |
Operating Temperature Range, C | 0 to 85,-40 to 100 | 0 to 85,-40 to 100 | 0 to 85,-40 to 100 | 0 to 85,-40 to 100 | 0 to 85,-40 to 100 |
Other On-Chip Memory | 2048 KB | 2048 KB | 2048 KB | 2048 KB | 2048 KB |
PCI/PCIe | 4 PCIe Gen2 | 4 PCIe Gen2 | 4 PCIe Gen2 | 4 PCIe Gen2 | 4 PCIe Gen2 |
Rating | Catalog | Catalog | Catalog | Catalog | Catalog |
SPI | 3 | 3 | 3 | 3 | 3 |
Serial I/O | Hyperlink,I2C,SPI,TSIP,UART,USB | Hyperlink,I2C,SPI,TSIP,UART,USB | Hyperlink,I2C,SPI,TSIP,UART,USB | Hyperlink,I2C,SPI,TSIP,UART,USB | Hyperlink,I2C,SPI,TSIP,UART,USB |
UART, SCI | 2 | 2 | 2 | 2 | 2 |
USB | 2 | 2 | 2 | 2 | 2 |
Plan ecológico
AM5K2E02ABD25 | AM5K2E02ABD4 | AM5K2E02ABDA25 | AM5K2E02ABDA4 | AM5K2E02XABD25 | |
---|---|---|---|---|---|
RoHS | Obediente | Obediente | Obediente | Obediente | Obediente |
Notas de aplicación
- Clocking Spreadsheet for K2E Device FamilyPDF, 22 Kb, Archivo publicado: enero 26, 2017
This document discusses the internal clocking architecture of Texas Instruments K2Ex Digital Signal Processors (DSP) using a provided clocking spreadsheet.The 66AK2Ex and AM5K2Ex devices have similar internal clocking architecture and peripherals except the corepac. The 66AK2Ex devices have both DSP corepac and ARM corepac, whereas, the AM5K2Ex devices have ARM corepac only.Use the K - Keystone II DDR3 InitializationPDF, 73 Kb, Archivo publicado: enero 26, 2015
This application report provides a step-to-step initialization guide for the Keystone II device DDR3 SDRAM controller. - Throughput Performance Guide for KeyStone II Devices (Rev. B)PDF, 866 Kb, Revisión: B, Archivo publicado: dic 22, 2015
This application report analyzes various performance measurements of the KeyStone II family of processors. It provides a throughput analysis of the various support peripherals to different end-points and memory access. - Keystone II DDR3 Debug GuidePDF, 143 Kb, Archivo publicado: oct 16, 2015
This guide provides tools for use when debugging a failing DDR3 interface on a KeyStone II device. - Power Management of KS2 Device (Rev. C)PDF, 61 Kb, Revisión: C, Archivo publicado: jul 15, 2016
This application report lists the steps to enable Class 0 Temperature Compensation (Class 0 TC) mode of SmartReflexв„ў Subsystem (SRSS) module available on such devices. - Hardware Design Guide for KeyStone II DevicesPDF, 1.8 Mb, Archivo publicado: marzo 24, 2014
- PCIe Use Cases for KeyStone DevicesPDF, 320 Kb, Archivo publicado: dic 13, 2011
- Clocking Design Guide for KeyStone DevicesPDF, 1.5 Mb, Archivo publicado: nov 9, 2010
- Optimizing Loops on the C66x DSPPDF, 585 Kb, Archivo publicado: nov 9, 2010
- The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)PDF, 20 Kb, Revisión: A, Archivo publicado: nov 10, 2010
The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM - DDR3 Design Requirements for KeyStone Devices (Rev. B)PDF, 582 Kb, Revisión: B, Archivo publicado: jun 5, 2014
- Multicore Programming Guide (Rev. B)PDF, 1.8 Mb, Revisión: B, Archivo publicado: agosto 29, 2012
As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore - Thermal Design Guide for DSP and ARM Application Processors (Rev. A)PDF, 324 Kb, Revisión: A, Archivo publicado: agosto 17, 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
Linea modelo
Serie: AM5K2E02 (5)
Clasificación del fabricante
- Semiconductors> Processors> Sitara Processors> ARM Cortex-A15> AM5K2Ex