Datasheet Texas Instruments XAM5728AABCXE — Ficha de datos
| Fabricante | Texas Instruments |
| Serie | AM5728 |
| Numero de parte | XAM5728AABCXE |
Procesador Sitara 760-FCBGA 0 a 90
Hojas de datos
AM572x Sitaraв„ў Processors Silicon Revision 2.0 datasheet
PDF, 4.6 Mb, Revisión: C, Archivo publicado: jun 6, 2017
Extracto del documento
Precios
Estado
| Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) |
| Disponibilidad de muestra del fabricante | No |
Embalaje
| Pin | 760 | 760 |
| Package Type | ABC | ABC |
| Industry STD Term | FCBGA | FCBGA |
| JEDEC Code | S-PBGA-N | S-PBGA-N |
| Package QTY | 1 | 1 |
| Device Marking | XAM5728AABCXE | SITARATM |
| Width (mm) | 23 | 23 |
| Length (mm) | 23 | 23 |
| Thickness (mm) | 2.39 | 2.39 |
| Pitch (mm) | .8 | .8 |
| Max Height (mm) | 2.96 | 2.96 |
| Mechanical Data | Descargar | Descargar |
Paramétricos
| ARM CPU | 2 ARM Cortex-A15 |
| ARM MHz (Max.) | 1500 |
| ARM MIPS(Max.) | 10500 |
| Application | Communications Equipment Enterprise Systems Industrial Personal Electronics |
| Approx. Price (US$) | 40.47 | 1ku |
| CAN(#) | 2 |
| Co-Processor(s) | 2 ARM Cortex-M4 4 PRU-ICSS |
| DMA(Ch) | 64-Ch EDMA |
| DRAM | DDR3(L) |
| DSP | 2 C66x |
| DSP MHz (Max.) | 750 |
| Display Options | 1 HDMI out 3 LCD out |
| EMAC | 10/100/1000 2-Port 1Gb Switch |
| General Purpose Memory | 1 16-bit (GPMC NAND flash NOR Flash SRAM) |
| Graphics Acceleration | 2 3D 1 2D |
| HDMI | 1 |
| I2C | 5 |
| IO Supply(V) | 1.8 3.3 |
| Industrial Protocols | 1588 EtherCAT EtherNet/IP POWERLINK PROFIBUS PROFINET RT/IRT SERCOS III |
| LCD | 3 |
| MMC/SD | 4 |
| McASP | 8 |
| On-Chip L1 Cache | 32 KB (ARM Cortex-A15) 32 KB (C66x) |
| On-Chip L2 Cache | 1 MB (ARM Cortex-A15) 288 KB (C66x) |
| Operating Systems | Android Integrity Linux Nucleus Neutrino TI-RTOS VxWorks Windows Embedded CE |
| Operating Temperature Range(C) | -40 to 105 0 to 90 |
| Other Hardware Acceleration | Crypto Accelerator |
| Other On-Chip Memory | 2.5 MB w/ECC |
| PCI/PCIe | 2 PCIe Gen 2 |
| PWM(Ch) | 3 |
| Package Group | FCBGA |
| QSPI | 1 |
| RTC | 1 |
| Rating | Catalog |
| SATA | 1 |
| SPI | 4 |
| Security Enabler | Cryptographic Acceleration Debug Security Device Identity External Memory Protection Initial Secure Programming Physical Security Secure Boot Secure Storage Software IP Protection Trusted Execution Environment |
| Serial I/O | CAN I2C SPI UART USB |
| UART(SCI) | 10 |
| USB | 2 |
| USB 2.0 | 1 |
| USB 3.0 | 1 |
| Video Port (Configurable) | 6+ |
| Video Resolution/Frame Rate | 1080p60 |
| eCAP | 3 |
| eQEP | 3 |
Plan ecológico
| RoHS | Obediente |
| Pb gratis | Sí |
Kits de diseño y Módulos de evaluación
- Development Kits: TMDXIDK5728
AM572x Industrial Development Kit (IDK)
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños) - Development Kits: TMDXIDK5718
AM571x Industrial Development Kit (IDK)
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños) - Evaluation Modules & Boards: TMDSEVM572X
AM572x Evaluation Module
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños) - Evaluation Modules & Boards: TMDSCM572X
TMDSEVM572x Camera Module
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños) - Development Kits: TMDXIDK57X-LCD
AM57x IDK LCD Kit
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
Notas de aplicación
- AM572x Thermal ConsiderationsPDF, 400 Kb, Archivo publicado: dic 6, 2016
This application report discusses thermal performance of the Sitara AM572x series processors. Data presented demonstrates the effects of different thermal management strategies in terms of processor junction temperature and power consumption across CPU loading and ambient temperature. - TPS659037 Operation With Higher Capacitive LoadingPDF, 811 Kb, Archivo publicado: oct 7, 2015
This TPS659037 Operation With Higher Capacitive Loading application report addresses use-cases where external components demand a higher capacitive loading than the rating of the TPS659037 SMPS-outputs (57-ОјF maximum per phase). The specification of the device with a rating of nominal 47 ОјF and maximum of 57 ОјF holds true. Exceeding these values is at the risk of the user and requires thorough val - TPS659037 Design GuidePDF, 62 Kb, Archivo publicado: sept 21, 2015
This application note provides guidance on schematic design and can be used as a design review of applications using the TPS659037 power management IC (PMIC). This document describes recommended external components recommended connections of select signals and contains a design checklist. Prior to using this guide TI recommends reading the user's guide TPS659037 User's Guide to Power AM572x an - TPS659037 Design Checklist (Rev. A)ZIP, 45 Kb, Revisión: A, Archivo publicado: enero 13, 2016
- DSPLIB for Processor SDK RTOSPDF, 461 Kb, Archivo publicado: nov 4, 2016
- AM572x GP EVM Power SimulationsPDF, 22.4 Mb, Archivo publicado: oct 8, 2015
The purpose of this application report is to present the flow, the environment settings and TI requirements used to perform the analysis of critical power nets of a platform using an application processor. The Power Delivery Network (PDN) performance is measured by extracting and analyzing three printed circuit board (PCB) parameters: DC resistivity, capacitor loop inductance, and broadband target - EMIF Tools (Rev. A)PDF, 207 Kb, Revisión: A, Archivo publicado: jun 5, 2017
At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes - AM57x Processor SDK Linux: Customization of Multicore Application to Run on a NePDF, 55 Kb, Archivo publicado: oct 6, 2016
When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they - Keystone EDMA FAQPDF, 1.3 Mb, Archivo publicado: sept 1, 2016
This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links. - AM572x/AM571x Compatibility Guide (Rev. C)PDF, 182 Kb, Revisión: C, Archivo publicado: feb 22, 2016
This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices. - Code Composer Studio Device Support PackagePDF, 87 Kb, Archivo publicado: nov 19, 2015
This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS). - IODELAY Application Note for AM57xx Devices (Rev. A)PDF, 785 Kb, Revisión: A, Archivo publicado: agosto 3, 2017
- AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)PDF, 2.2 Mb, Revisión: A, Archivo publicado: mayo 1, 2004
Application Note 1281 Bumped Die (Flip Chip) Packages - TI DSP BenchmarkingPDF, 62 Kb, Archivo publicado: enero 13, 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms. - Thermal Design Guide for DSP and ARM Application Processors (Rev. A)PDF, 324 Kb, Revisión: A, Archivo publicado: agosto 17, 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require - Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, Revisión: B, Archivo publicado: agosto 13, 2015
- High-Speed Interface Layout Guidelines (Rev. G)PDF, 814 Kb, Revisión: G, Archivo publicado: jul 27, 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
Linea modelo
Serie: AM5728 (5)
- AM5728BABCX AM5728BABCXA AM5728BABCXEA XAM5728AABCXE XAM5728BABCXE
Clasificación del fabricante
- Semiconductors > Processors > Sitara Processors > ARM Cortex-A15 > AM57x