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AM5706ACBDJEA

Datasheet Texas Instruments AM5706ACBDJEA — Ficha de datos

FabricanteTexas Instruments
SerieAM5706
Numero de parteAM5706ACBDJEA

Procesador Sitara 538-FCBGA -40 a 105

Hojas de datos

Descargar
AM570x Sitaraв„ў Processors datasheet
PDF, 3.7 Mb, Revisión: A, Archivo publicado: feb 16, 2017
Extracto del documento

Precios

Estado

Estado del ciclo de vidaVista previa (El dispositivo ha sido anunciado pero no está en producción. Las muestras pueden o no estar disponibles)
Disponibilidad de muestra del fabricanteNo

Embalaje

Pin538
Package TypeCBD
Width (mm)17
Length (mm)17
Thickness (mm).878
Mechanical DataDescargar

Paramétricos

ARM CPU1 ARM Cortex-A15
ARM MHz (Max.)500
1000
ARM MIPS(Max.)1750
3500
ApplicationCommunications Equipment
Enterprise Systems
Industrial
Personal Electronics
CAN(#)2
CSI-21
Co-Processor(s)2 ARM Cortex-M4
4 PRU-ICSS
DMA(Ch)64-Ch EDMA
DRAMDDR3(L)
DSP1 C66x
DSP MHz (Max.)500
750
EMAC10/100/1000
2-Port 1Gb Switch
General Purpose Memory1 16-bit (GPMC
NAND flash
NOR Flash
SRAM)
I2C5
IO Supply(V)1.8
3.3
Industrial Protocols1588
EtherCAT
EtherNet/IP
POWERLINK
PROFIBUS
PROFINET RT/IRT
SERCOS III
MMC/SD4
McASP8
On-Chip L1 Cache32 KB (ARM Cortex-A15)
32 KB (C66x)
On-Chip L2 Cache1 MB w/ECC (ARM Cortex-A15)
288 KB (C66x)
Operating SystemsAndroid
Integrity
Linux
Nucleus
Neutrino
TI-RTOS
VxWorks
Windows Embedded CE
Operating Temperature Range(C)-40 to 105
Other Hardware AccelerationCrypto Accelerator
Other On-Chip Memory512 KB w/ECC
PCI/PCIe2 PCIe
PWM(Ch)3
Package GroupFCBGA
QSPI1
RatingCatalog
SPI4
Security EnablerCryptographic Acceleration
Debug Security
Device Identity
External Memory Protection
Initial Secure Programming
Physical Security
Secure Boot
Secure Storage
Software IP Protection
Trusted Execution Environment
Serial I/OCAN
I2C
SPI
UART
USB
UART(SCI)10
USB2
USB 2.01
USB 3.01
Video Port (Configurable)4
eCAP3
eQEP3

Plan ecológico

RoHSDesobediente
Pb gratisNo

Kits de diseño y Módulos de evaluación

  • Development Kits: TMDXIDK5718
    AM571x Industrial Development Kit (IDK)
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • Evaluation Modules & Boards: TMDSEVM572X
    AM572x Evaluation Module
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • Evaluation Modules & Boards: TMDSCM572X
    TMDSEVM572x Camera Module
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • Development Kits: TMDXIDK57X-LCD
    AM57x IDK LCD Kit
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • JTAG Emulators/ Analyzers: TMDSEMU110-U
    XDS110 JTAG Debug Probe
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)

Notas de aplicación

  • Descargar
    DSPLIB for Processor SDK RTOS
    PDF, 461 Kb, Archivo publicado: nov 4, 2016
  • Descargar
    IODELAY Application Note for AM57xx Devices (Rev. A)
    PDF, 785 Kb, Revisión: A, Archivo publicado: agosto 3, 2017
  • Descargar
    Code Composer Studio Device Support Package
    PDF, 87 Kb, Archivo publicado: nov 19, 2015
    This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS).
  • Descargar
    AM572x/AM571x Compatibility Guide (Rev. C)
    PDF, 182 Kb, Revisión: C, Archivo publicado: feb 22, 2016
    This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices.
  • Descargar
    AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne
    PDF, 55 Kb, Archivo publicado: oct 6, 2016
    When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they
  • Descargar
    EMIF Tools (Rev. A)
    PDF, 207 Kb, Revisión: A, Archivo publicado: jun 5, 2017
    At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes
  • Descargar
    Keystone EDMA FAQ
    PDF, 1.3 Mb, Archivo publicado: sept 1, 2016
    This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links.
  • Descargar
    AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
    PDF, 2.2 Mb, Revisión: A, Archivo publicado: mayo 1, 2004
    Application Note 1281 Bumped Die (Flip Chip) Packages
  • Descargar
    TI DSP Benchmarking
    PDF, 62 Kb, Archivo publicado: enero 13, 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
  • Descargar
    Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Kb, Revisión: A, Archivo publicado: agosto 17, 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
  • Descargar
    Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, Revisión: B, Archivo publicado: agosto 13, 2015
  • Descargar
    High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, Revisión: G, Archivo publicado: jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Linea modelo

Serie: AM5706 (2)

Clasificación del fabricante

  • Semiconductors > Processors > Sitara Processors > ARM Cortex-A15 > AM57x