Datasheet Texas Instruments AM3358 — Ficha de datos
Fabricante | Texas Instruments |
Serie | AM3358 |
Procesador Sitara
Hojas de datos
AM335x Sitaraв„ў Processors datasheet
PDF, 3.2 Mb, Revisión: J, Archivo publicado: abr 12, 2016
Extracto del documento
Precios
Estado
AM3358BZCZ100 | AM3358BZCZ60 | AM3358BZCZ80 | AM3358BZCZA100 | AM3358BZCZA80 | |
---|---|---|---|---|---|
Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) | Activo (Recomendado para nuevos diseños) |
Disponibilidad de muestra del fabricante | Sí | Sí | Sí | No | No |
Embalaje
AM3358BZCZ100 | AM3358BZCZ60 | AM3358BZCZ80 | AM3358BZCZA100 | AM3358BZCZA80 | |
---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 |
Pin | 324 | 324 | 324 | 324 | 324 |
Package Type | ZCZ | ZCZ | ZCZ | ZCZ | ZCZ |
Package QTY | 126 | 126 | 126 | 126 | 126 |
Device Marking | AM3358BZCZ100 | AM3358BZCZ60 | AM3358BZCZ80 | AM3358BZCZA100 | AM3358BZCZA80 |
Width (mm) | 15 | 15 | 15 | 15 | 15 |
Length (mm) | 15 | 15 | 15 | 15 | 15 |
Thickness (mm) | .9 | .9 | .9 | .9 | .9 |
Mechanical Data | Descargar | Descargar | Descargar | Descargar | Descargar |
Paramétricos
Parameters / Models | AM3358BZCZ100 | AM3358BZCZ60 | AM3358BZCZ80 | AM3358BZCZA100 | AM3358BZCZA80 |
---|---|---|---|---|---|
ARM CPU | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 |
ARM MHz, Max. | 600,800,1000 | 600,800,1000 | 600,800,1000 | 600,800,1000 | 600,800,1000 |
Applications | Automotive,Industrial,Personal Electronics | Automotive,Industrial,Personal Electronics | Automotive,Industrial,Personal Electronics | Automotive,Industrial,Personal Electronics | Automotive,Industrial,Personal Electronics |
Co-Processor, s | 2 PRU-ICSS | 2 PRU-ICSS | 2 PRU-ICSS | 2 PRU-ICSS | 2 PRU-ICSS |
DMIPS | 1200,1600,2000 | 1200,1600,2000 | 1200,1600,2000 | 1200,1600,2000 | 1200,1600,2000 |
DRAM | DDR2,DDR3,DDR3L,LPDDR | DDR2,DDR3,DDR3L,LPDDR | DDR2,DDR3,DDR3L,LPDDR | DDR2,DDR3,DDR3L,LPDDR | DDR2,DDR3,DDR3L,LPDDR |
Display Outputs | 1 | 1 | 1 | 1 | 1 |
EMAC | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch |
Graphics Acceleration | 1 3D | 1 3D | 1 3D | 1 3D | 1 3D |
Industrial Protocols | 1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III | 1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III |
On-Chip L2 Cache | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) |
Operating Systems | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE |
Operating Temperature Range, C | -40 to 105,0 to 90 | -40 to 105,0 to 90 | -40 to 105,0 to 90 | -40 to 105,0 to 90 | -40 to 105,0 to 90 |
Other On-Chip Memory | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
Rating | Catalog | Catalog | Catalog | Catalog | Catalog |
Security Enabler | Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment | Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment | Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment | Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment | Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment |
Serial I/O | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB |
Plan ecológico
AM3358BZCZ100 | AM3358BZCZ60 | AM3358BZCZ80 | AM3358BZCZA100 | AM3358BZCZA80 | |
---|---|---|---|---|---|
RoHS | Obediente | Obediente | Obediente | Obediente | Obediente |
Notas de aplicación
- AM335x Low Power Design Guide (Rev. A)PDF, 300 Kb, Revisión: A, Archivo publicado: feb 28, 2017
This document discusses techniques to develop a low power, low cost system based on the AM335x series processor. The goal is to explain how system design choices affect power consumption and how power consumption can vary significantly depending on how the developer’s application runs in that system under specific conditions. - AM335x Reliability Considerations in PLC Applications (Rev. A)PDF, 112 Kb, Revisión: A, Archivo publicado: abr 27, 2017
Programmable Logic Controllers (PLC) are used as the main control in an automation system with high-reliability expectations and long life in harsh environments. Processors used in these applications require an assessment of performance verses expected power on hours to achieve the optimal performance for the application. - AM335x and AM43xx Sitara Processors USB Layout Guidelines (Rev. A)PDF, 76 Kb, Revisión: A, Archivo publicado: agosto 21, 2014
This application report discusses best-practice layout guidelines when implementing a universal serial bus (USB). - Processor SDK RTOS Customization: Modifying Board library to change UART instancPDF, 783 Kb, Archivo publicado: marzo 4, 2016
- AM335x Thermal ConsiderationsPDF, 16 Kb, Archivo publicado: abr 15, 2013
This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of the processor's thermal performance, suggests improvements for an end system to aid in overcoming some of the existing challenges of producing a good thermal design, and provides real power/thermal data measured with AM335x EVMs for user evaluation. - nFBGA Packaging (Rev. B)PDF, 3.1 Mb, Revisión: B, Archivo publicado: nov 13, 2015
This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts. - 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)PDF, 40.5 Mb, Revisión: A, Archivo publicado: agosto 9, 2015
- Thermal Design Guide for DSP and ARM Application Processors (Rev. A)PDF, 324 Kb, Revisión: A, Archivo publicado: agosto 17, 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require - Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, Revisión: B, Archivo publicado: agosto 13, 2015
- High-Speed Interface Layout Guidelines (Rev. G)PDF, 814 Kb, Revisión: G, Archivo publicado: jul 27, 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
Linea modelo
Serie: AM3358 (5)
Clasificación del fabricante
- Semiconductors> Processors> Sitara Processors> ARM Cortex-A8> AM335x