Datasheet Texas Instruments AM3354 — Ficha de datos

FabricanteTexas Instruments
SerieAM3354
Datasheet Texas Instruments AM3354

Procesador Sitara

Hojas de datos

AM335x Sitaraв„ў Processors datasheet
PDF, 3.2 Mb, Revisión: J, Archivo publicado: abr 12, 2016
Extracto del documento

Precios

Estado

AM3354BZCE60AM3354BZCEA60AM3354BZCED60AM3354BZCZ100AM3354BZCZ30AM3354BZCZ60AM3354BZCZ80AM3354BZCZA100AM3354BZCZA60AM3354BZCZA80AM3354BZCZA80RAM3354BZCZD60AM3354BZCZD80
Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNoNoNoNoNoNo

Embalaje

AM3354BZCE60AM3354BZCEA60AM3354BZCED60AM3354BZCZ100AM3354BZCZ30AM3354BZCZ60AM3354BZCZ80AM3354BZCZA100AM3354BZCZA60AM3354BZCZA80AM3354BZCZA80RAM3354BZCZD60AM3354BZCZD80
N12345678910111213
Pin298298298324324324324324324324324324324
Package TypeZCEZCEZCEZCZZCZZCZZCZZCZZCZZCZZCZZCZZCZ
Industry STD TermNFBGANFBGANFBGA
JEDEC CodeS-PBGA-NS-PBGA-NS-PBGA-N
Package QTY1601601601261261261261261261261000126126
Device MarkingAM3354BZCE60AM3354BZCEA60AM3354BZCED60AM3354BZCZ100AM3354BZCZ30AM3354BZCZ60AM3354BZCZ80AM3354BZCZA100AM3354BZCZA60AM3354BZCZA80AM3354BZCZA80AM3354BZCZD60AM3354BZCZD80
Width (mm)13131315151515151515151515
Length (mm)13131315151515151515151515
Thickness (mm).89.89.89.9.9.9.9.9.9.9.9.9.9
Pitch (mm).65.65.65
Max Height (mm)1.31.31.3
Mechanical DataDescargarDescargarDescargarDescargarDescargarDescargarDescargarDescargarDescargarDescargarDescargarDescargarDescargar
CarrierJEDEC TRAY (10+1)

Paramétricos

Parameters / ModelsAM3354BZCE60
AM3354BZCE60
AM3354BZCEA60
AM3354BZCEA60
AM3354BZCED60
AM3354BZCED60
AM3354BZCZ100
AM3354BZCZ100
AM3354BZCZ30
AM3354BZCZ30
AM3354BZCZ60
AM3354BZCZ60
AM3354BZCZ80
AM3354BZCZ80
AM3354BZCZA100
AM3354BZCZA100
AM3354BZCZA60
AM3354BZCZA60
AM3354BZCZA80
AM3354BZCZA80
AM3354BZCZA80R
AM3354BZCZA80R
AM3354BZCZD60
AM3354BZCZD60
AM3354BZCZD80
AM3354BZCZD80
ARM CPU1 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A8
ARM MHz, Max.600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000600,800,1000
ApplicationsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal Electronics
Co-Processor, sN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/AN/A
DMIPS1200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,20001200,1600,2000
DRAMDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDR
Display Outputs1111111111111
EMAC2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch2-Port 1Gb Switch
Graphics Acceleration1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D
On-Chip L2 Cache256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)
Operating SystemsAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE
Operating Temperature Range, C-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90
Other On-Chip Memory128 KB128 KB128 KB128 KB128 KB128 KB128 KB128 KB128 KB128 KB128 KB128 KB128 KB
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Security EnablerCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment
Serial I/OCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USB

Plan ecológico

AM3354BZCE60AM3354BZCEA60AM3354BZCED60AM3354BZCZ100AM3354BZCZ30AM3354BZCZ60AM3354BZCZ80AM3354BZCZA100AM3354BZCZA60AM3354BZCZA80AM3354BZCZA80RAM3354BZCZD60AM3354BZCZD80
RoHSObedienteObedienteObedienteObedienteObedienteObedienteObedienteObedienteObedienteObedienteObedienteObedienteObediente

Notas de aplicación

  • AM335x Low Power Design Guide (Rev. A)
    PDF, 300 Kb, Revisión: A, Archivo publicado: feb 28, 2017
    This document discusses techniques to develop a low power, low cost system based on the AM335x series processor. The goal is to explain how system design choices affect power consumption and how power consumption can vary significantly depending on how the developer’s application runs in that system under specific conditions.
  • AM335x Reliability Considerations in PLC Applications (Rev. A)
    PDF, 112 Kb, Revisión: A, Archivo publicado: abr 27, 2017
    Programmable Logic Controllers (PLC) are used as the main control in an automation system with high-reliability expectations and long life in harsh environments. Processors used in these applications require an assessment of performance verses expected power on hours to achieve the optimal performance for the application.
  • AM335x and AM43xx Sitara Processors USB Layout Guidelines (Rev. A)
    PDF, 76 Kb, Revisión: A, Archivo publicado: agosto 21, 2014
    This application report discusses best-practice layout guidelines when implementing a universal serial bus (USB).
  • Processor SDK RTOS Customization: Modifying Board library to change UART instanc
    PDF, 783 Kb, Archivo publicado: marzo 4, 2016
  • AM335x Thermal Considerations
    PDF, 16 Kb, Archivo publicado: abr 15, 2013
    This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of the processor's thermal performance, suggests improvements for an end system to aid in overcoming some of the existing challenges of producing a good thermal design, and provides real power/thermal data measured with AM335x EVMs for user evaluation.
  • nFBGA Packaging (Rev. B)
    PDF, 3.1 Mb, Revisión: B, Archivo publicado: nov 13, 2015
    This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
  • 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
    PDF, 40.5 Mb, Revisión: A, Archivo publicado: agosto 9, 2015
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Kb, Revisión: A, Archivo publicado: agosto 17, 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, Revisión: B, Archivo publicado: agosto 13, 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, Revisión: G, Archivo publicado: jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Linea modelo

Clasificación del fabricante

  • Semiconductors> Processors> Sitara Processors> ARM Cortex-A8> AM335x