Datasheet Texas Instruments 74AC11240 — Ficha de datos

FabricanteTexas Instruments
Serie74AC11240
Datasheet Texas Instruments 74AC11240

Buffers / controladores octales

Hojas de datos

Octal Buffer/Line Driver With 3-State Outputs datasheet
PDF, 573 Kb, Revisión: A, Archivo publicado: abr 1, 1996
Extracto del documento

Precios

Estado

74AC11240DBLE74AC11240DBR74AC11240DBRG474AC11240DW74AC11240PW
Estado del ciclo de vidaObsoleto (El fabricante ha interrumpido la producción del dispositivo)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricanteNoNoNoNoNo

Embalaje

74AC11240DBLE74AC11240DBR74AC11240DBRG474AC11240DW74AC11240PW
N12345
Pin2424242424
Package TypeDBDBDBDWPW
Industry STD TermSSOPSSOPSSOPSOICTSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Width (mm)5.35.35.37.54.4
Length (mm)8.28.28.215.47.8
Thickness (mm)1.951.951.952.351
Pitch (mm).65.65.651.27.65
Max Height (mm)2222.651.2
Mechanical DataDescargarDescargarDescargarDescargarDescargar
Package QTY200020002560
CarrierLARGE T&RLARGE T&RTUBETUBE
Device MarkingAE240AE240AC11240AE240

Paramétricos

Parameters / Models74AC11240DBLE
74AC11240DBLE
74AC11240DBR
74AC11240DBR
74AC11240DBRG4
74AC11240DBRG4
74AC11240DW
74AC11240DW
74AC11240PW
74AC11240PW
Approx. Price (US$)1.65 | 1ku
Bits8888
Bits(#)8
F @ Nom Voltage(Max), Mhz100100100100
F @ Nom Voltage(Max)(Mhz)100
ICC @ Nom Voltage(Max), mA0.080.080.080.08
ICC @ Nom Voltage(Max)(mA)0.08
Input TypeCMOS
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85
Operating Temperature Range(C)-40 to 85
Output Drive (IOL/IOH)(Max), mA-24/24-24/24-24/24-24/24
Output Drive (IOL/IOH)(Max)(mA)-24/24
Output TypeCMOS
Package GroupSSOPSSOPSSOPSOICTSSOP
Package Size: mm2:W x L, PKG24SSOP: 64 mm2: 7.8 x 8.2(SSOP)24SSOP: 64 mm2: 7.8 x 8.2(SSOP)24SOIC: 160 mm2: 10.3 x 15.5(SOIC)24TSSOP: 50 mm2: 6.4 x 7.8(TSSOP)
Package Size: mm2:W x L (PKG)See datasheet (PDIP)
RatingCatalogCatalogCatalogCatalogCatalog
Schmitt TriggerNoNoNoNoNo
Technology FamilyACACACACAC
VCC(Max), V5.55.55.55.5
VCC(Max)(V)5.5
VCC(Min), V3333
VCC(Min)(V)3
Voltage(Nom), V3.3,53.3,53.3,53.3,5
Voltage(Nom)(V)3.3
5
tpd @ Nom Voltage(Max), ns11.7,8.411.7,8.411.7,8.411.7,8.4
tpd @ Nom Voltage(Max)(ns)11.7
8.4

Plan ecológico

74AC11240DBLE74AC11240DBR74AC11240DBRG474AC11240DW74AC11240PW
RoHSDesobedienteObedienteObedienteObedienteObediente
Pb gratisNo

Notas de aplicación

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    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
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    The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Archivo publicado: jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, Archivo publicado: oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, Revisión: B, Archivo publicado: jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, Archivo publicado: agosto 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, Revisión: D, Archivo publicado: jun 23, 2016
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Kb, Archivo publicado: abr 1, 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

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Clasificación del fabricante

  • Semiconductors> Logic> Buffer/Driver/Transceiver> Inverting Buffer/Driver