Datasheet Texas Instruments ISO7831FDWW — Ficha de datos
| Fabricante | Texas Instruments |
| Serie | ISO7831 |
| Numero de parte | ISO7831FDWW |
Aislador digital 2/1 de triple canal reforzado de 5.7kVRMS de alta inmunidad, 100Mbps 16-SOIC -55 a 125
Hojas de datos
ISO7831x High-Performance, 8000-VPK Reinforced Triple Digital Isolators datasheet
PDF, 1.4 Mb, Revisión: B, Archivo publicado: jun 28, 2016
Extracto del documento
Precios
Estado
| Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) |
| Disponibilidad de muestra del fabricante | No |
Embalaje
| Pin | 16 |
| Package Type | DWW |
| Package QTY | 45 |
| Carrier | TUBE |
| Device Marking | ISO7831F |
| Width (mm) | 14 |
| Length (mm) | 10.3 |
| Thickness (mm) | 2.45 |
| Mechanical Data | Descargar |
Paramétricos
| Data Rate(Max) | 100 Mbps |
| Default Output | Low |
| Forward/Reverse Channels | 2/1 |
| Integrated Isolated Power | No |
| Isolation Rating | 5700 Vrms |
| Number of Channels | 3 |
| Operating Temperature Range | -55 to 125 C |
| Package Group | SOIC |
| Package Size: mm2:W x L | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) PKG |
| Propagation Delay | 10.7 ns |
| Propagation Delay(Typ) | 10.7 ns |
| Rating | Catalog |
| Surge Voltage Rating | 8000 Vpk |
| VCC(Max) | 5.5 V |
| VCC(Min) | 2.25 V |
Plan ecológico
| RoHS | Obediente |
Kits de diseño y Módulos de evaluación
- Evaluation Modules & Boards: LMG3410-HB-EVM
LMG3410 Daughter Card
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños) - Evaluation Modules & Boards: ISO7842-EVM
High-Immunity, 5.7kVRMS Reinforced Quad-Channel 2/2 Digital Isolator Evaluation Module
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
Notas de aplicación
- Pushing the envelope with high-performance digital-isolation technologyPDF, 147 Kb, Archivo publicado: oct 30, 2015
- Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Mb, Archivo publicado: mayo 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a - 4Q 2015 Analog Applications JournalPDF, 1.6 Mb, Archivo publicado: oct 30, 2015
- Isolation GlossaryPDF, 52 Kb, Archivo publicado: oct 27, 2014
- Digital Isolator Design Guide (Rev. A)PDF, 487 Kb, Revisión: A, Archivo publicado: nov 4, 2014
Linea modelo
Serie: ISO7831 (8)
Clasificación del fabricante
- Semiconductors > Isolation > Digital Isolators