Datasheet Texas Instruments TMS320DM335CZCE216 — Ficha de datos
Fabricante | Texas Instruments |
Serie | TMS320DM335 |
Numero de parte | TMS320DM335CZCE216 |
Sistema de medios digitales en chip (DMSoC) 337-NFBGA
Hojas de datos
TMS320DM335 Digital Media System-on-Chip (DMSoC) datasheet
PDF, 1.2 Mb, Revisión: C, Archivo publicado: jun 24, 2010
Extracto del documento
Precios
Estado
Estado del ciclo de vida | NRND (No recomendado para nuevos diseños) |
Disponibilidad de muestra del fabricante | No |
Embalaje
Pin | 337 | 337 | 337 | 337 |
Package Type | ZCE | ZCE | ZCE | ZCE |
Industry STD Term | NFBGA | NFBGA | NFBGA | NFBGA |
JEDEC Code | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N |
Device Marking | DM335CZCE | TMS320 | DM355ZCE 216 | 216 |
Width (mm) | 13 | 13 | 13 | 13 |
Length (mm) | 13 | 13 | 13 | 13 |
Thickness (mm) | .89 | .89 | .89 | .89 |
Pitch (mm) | .65 | .65 | .65 | .65 |
Max Height (mm) | 1.3 | 1.3 | 1.3 | 1.3 |
Mechanical Data | Descargar | Descargar | Descargar | Descargar |
Plan ecológico
RoHS | Desobediente |
Pb gratis | No |
Kits de diseño y Módulos de evaluación
- Development Kits: TMDSEVM355
TMS320DM355 Digital Video Evaluation Module
Estado del ciclo de vida: NRND (No recomendado para nuevos diseños) - JTAG Emulators/ Analyzers: TMDSEMU200-U
XDS200 USB Debug Probe
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
XDS560v2 System Trace USB & Ethernet Debug Probe
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
XDS560v2 System Trace USB Debug Probe
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
Notas de aplicación
- Implementing DDR2/mDDR PCB Layout on the TMS320DM335 DMSoC (Rev. D)PDF, 127 Kb, Revisión: D, Archivo publicado: nov 11, 2009
This application report contains implementation instructions for the DDR2/mDDR interface contained on the TMS320DM335 Digital Media System-on-Chip (DMSoC) device. The approach to specifying interface timing for the DDR2/mDDR interface is quite different than on previous devices.The previous approach specified device timing in terms of data sheet specifications and simulation models. The syste - TMS320DM355/335 Migration Guide (Silicon revision 1.1, 1.3 and 1.4) (Rev. B)PDF, 75 Kb, Revisión: B, Archivo publicado: enero 5, 2011
This application report describes the differences between Silicon revision 1.1, 1.3 and 1.4 of the TMS320DM355/DM335 digital media system-on-chip (DMSoC). This document discusses behavior different from that described in the TMS320DM355 Digital Media System-on-Chip (DMSoC) ARM Subsystem User's Guide (SPRUFB3) and the TMS320DM335 Digital Med - Powering the TMS320DM335 and TMS320DM355 with the TPS650061PDF, 144 Kb, Archivo publicado: oct 13, 2011
TPS650061, TMS320DM335, TMS320DM355 Powering the DM335 and DM355 with the TPS650061 - TMS320DM355 DSP Power Reference Design PR742 (Rev. A)PDF, 199 Kb, Revisión: A, Archivo publicado: agosto 8, 2008
This reference design is for the TMS320DM335/DM355 digital signal processor (DSP) and accounts for voltage, current, and sequencing requirements. The operating input voltage ranges from 2 V to 5.5 V for Li-ion batteries and 3 AA batteries. This design also can work with 2 AA batteries with some limitations. The design is optimized for efficiency over the full range of operation and low overall cos - Building a Small Embedded Linux Kernel Example (Rev. A)PDF, 1.3 Mb, Revisión: A, Archivo publicado: mayo 27, 2008
Building a Small Embedded Linux Kernel Example Application Report - EDMA v2.0 to EDMA v3.0 (EDMA3) Migration Guide (Rev. A)PDF, 292 Kb, Revisión: A, Archivo publicado: agosto 21, 2008
This application report summarizes the key differences between the enhanced direct memory access (EDMA3) used on C64x+в„ў DSP devices and the EDMA2 used on TMS320C64xв„ў DSP devices, and provides guidance for migrating from EDMA2 to EDMA3. - Understanding TI's PCB Routing Rule-Based DDR Timing Specification (Rev. A)PDF, 93 Kb, Revisión: A, Archivo publicado: jul 17, 2008
This application report motivates the way the DDR high-speed timing requirements are now going to be communicated to system designers. The traditional method of using data sheet parameters and simulation models is tedious. The system designer uses this information to evaluate whether timing specifications are met and can be expected to operate reliably.Ultimately, the real question the hardwa - High-Speed Interface Layout Guidelines (Rev. G)PDF, 814 Kb, Revisión: G, Archivo publicado: jul 27, 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
Linea modelo
Serie: TMS320DM335 (6)
- TMS320DM335CZCE216 TMS320DM335DZCE135 TMS320DM335DZCE216 TMS320DM335ZCE270 TMS320DM335ZCEA135 TMS320DM335ZCEA216
Clasificación del fabricante
- Semiconductors > Processors > Digital Signal Processors > Media Processors > DaVinci Video Processors