Datasheet Texas Instruments OMAPL138BGWTMEP — Ficha de datos
| Fabricante | Texas Instruments |
| Serie | OMAPL138B-EP |
| Numero de parte | OMAPL138BGWTMEP |
Producto mejorado Procesador de aplicaciones de baja potencia 361-NFBGA -55 a 125
Hojas de datos
OMAPL138B-EP C6000 DSP+ARMВ® Processor datasheet
PDF, 1.8 Mb, Revisión: C, Archivo publicado: abr 12, 2013
Extracto del documento
Precios
Estado
| Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) |
| Disponibilidad de muestra del fabricante | No |
Embalaje
| Pin | 361 | 361 | 361 |
| Package Type | GWT | GWT | GWT |
| Industry STD Term | NFBGA | NFBGA | NFBGA |
| JEDEC Code | S-PBGA-N | S-PBGA-N | S-PBGA-N |
| Package QTY | 90 | 90 | 90 |
| Carrier | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) |
| Device Marking | GWTMEP | 21 | OMAPL138B |
| Width (mm) | 16 | 16 | 16 |
| Length (mm) | 16 | 16 | 16 |
| Thickness (mm) | .9 | .9 | .9 |
| Pitch (mm) | .8 | .8 | .8 |
| Max Height (mm) | 1.4 | 1.4 | 1.4 |
| Mechanical Data | Descargar | Descargar | Descargar |
Paramétricos
| ARM CPU | 1 ARM9 |
| ARM MHz | 345 Max. |
| Applications | Communications and Telecom,Energy,Industrial,Medical |
| DRAM | LPDDR,DDR2 |
| DSP | 1 C674x |
| DSP MHz | 345 Max. |
| Display Options | 1 |
| EMAC | 10/100 |
| I2C | 2 |
| On-Chip L2 Cache | 256 KB (DSP) |
| Operating Systems | Linux,SYS/BIOS |
| Operating Temperature Range | -55 to 125 C |
| Other On-Chip Memory | 128 KB |
| Rating | HiRel Enhanced Product |
| SPI | 2 |
| UART | 3 SCI |
| USB | 2 |
| Video Port | 1 Configurable |
Plan ecológico
| RoHS | See ti.com |
Kits de diseño y Módulos de evaluación
- JTAG Emulators/ Analyzers: TMDSEMU200-U
XDS200 USB Debug Probe
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
XDS560v2 System Trace USB & Ethernet Debug Probe
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
XDS560v2 System Trace USB Debug Probe
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
Notas de aplicación
- nFBGA Packaging (Rev. B)PDF, 3.1 Mb, Revisión: B, Archivo publicado: nov 13, 2015
This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts. - Processor SDK RTOS Audio Benchmark Starter KitPDF, 530 Kb, Archivo publicado: abr 12, 2017
The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device - 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)PDF, 40.5 Mb, Revisión: A, Archivo publicado: agosto 9, 2015
- Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, Revisión: B, Archivo publicado: agosto 13, 2015
Linea modelo
Serie: OMAPL138B-EP (2)
- OMAPL138BGWTMEP V62/12605-01XE
Clasificación del fabricante
- Semiconductors > Space & High Reliability > Processor > Digital Signal Processor > C6000 DSP + ARM Processor