Datasheet Texas Instruments SN74CB3T16212DGGR — Ficha de datos

FabricanteTexas Instruments
SerieSN74CB3T16212
Numero de parteSN74CB3T16212DGGR
Datasheet Texas Instruments SN74CB3T16212DGGR

Conmutador de bus FET de 24 bits Intercambiador de bus de bajo voltaje de 2.5 V / 3.3 V con palanca de cambio de nivel tolerante a 5 V 56-TSSOP -40 a 85

Hojas de datos

SN74CB3T16212 datasheet
PDF, 1.1 Mb, Revisión: A, Archivo publicado: enero 28, 2005
Extracto del documento

Precios

Estado

Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricante

Embalaje

Pin56
Package TypeDGG
Industry STD TermTSSOP
JEDEC CodeR-PDSO-G
Package QTY2000
CarrierLARGE T&R
Device MarkingCB3T16212
Width (mm)6.1
Length (mm)14
Thickness (mm)1.15
Pitch (mm).5
Max Height (mm)1.2
Mechanical DataDescargar

Paramétricos

Additional FeaturesPowered off protection,Signal path Translation
Bandwidth100 MHz
Configurationcrosspoint/exchange
ESD Charged Device Model1 kV
ESD HBM2 kV
Input/Ouput Voltage(Max)5.5 V
Input/Output Continuous Current(Max)128 mA
Input/Output OFF-state Capacitance(Typ)9 pF
Input/Output ON-state Capacitance(Typ)8 pF
Number of Channels24
OFF-state leakage current(Max)10 µA
Operating Temperature Range-40 to 85 C
Package GroupTSSOP
Package Size: mm2:W x L56TSSOP: 113 mm2: 8.1 x 14(TSSOP) PKG
RatingCatalog
Ron(Max)9.5 Ohms
Ron(Typ)5 Ohms
Supply Current(Max)20 uA
Supply Range3.6 Max
VIH(Min)1.7 V
VIL(Max)0.8 V
Vdd(Max)3.6 V
Vdd(Min)2.3 V
Vss(Max)N/A V
Vss(Min)N/A V

Plan ecológico

RoHSObediente

Notas de aplicación

  • CBT-C, CB3T, and CB3Q Signal-Switch Families
    PDF, 584 Kb, Archivo publicado: feb 4, 2003
    Signal switch devices are widely used in applications requiring bus isolation, multiplexing, demultiplexing, and voltage translation. Compared to other logic and linear product alternatives, signal switches are the fastest and least power consuming. Texas Instruments (TI) CBT-C, CB3Q, and CB3T signal-switch families have low on-state resistance, negligible power consumption, and better undershoot
  • Bus FET Switch Solutions for Live Insertion Applications
    PDF, 300 Kb, Archivo publicado: feb 7, 2003
    In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ

Linea modelo

Clasificación del fabricante

  • Semiconductors > Switches and Multiplexers > Analog Switches/Muxes