Datasheet Texas Instruments 74ACT16623DLR — Ficha de datos

Fabricante	Texas Instruments
Serie	74ACT16623
Numero de parte	74ACT16623DLR

Transceptores de bus de 16 bits con salidas de 3 estados 48-SSOP -40 a 85

Hojas de datos

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PDF, 302 Kb, Revisión: A, Archivo publicado: abr 1, 1996

Extracto del documento

Precios

Estado

Estado del ciclo de vida	Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricante	No

Embalaje

Pin	48
Package Type	DL
Industry STD Term	SSOP
JEDEC Code	R-PDSO-G
Package QTY	1000
Carrier	LARGE T&R
Device Marking	ACT16623
Width (mm)	7.49
Length (mm)	15.88
Thickness (mm)	2.59
Pitch (mm)	.635
Max Height (mm)	2.79
Mechanical Data	Descargar

Paramétricos

Bits	16
F @ Nom Voltage(Max)	90 Mhz
ICC @ Nom Voltage(Max)	0.08 mA
Operating Temperature Range	-40 to 85 C
Output Drive (IOL/IOH)(Max)	-24/24 mA
Package Group	SSOP
Package Size: mm2:W x L	48SSOP: 164 mm2: 10.35 x 15.88(SSOP) PKG
Rating	Catalog
Schmitt Trigger	No
Technology Family	ACT
VCC(Max)	5.5 V
VCC(Min)	4.5 V
Voltage(Nom)	5 V
tpd @ Nom Voltage(Max)	10.4 ns

Plan ecológico

RoHS

Obediente

Notas de aplicación

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Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
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TI IBIS File Creation Validation and Distribution Processes
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The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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CMOS Power Consumption and CPD Calculation (Rev. B)
PDF, 89 Kb, Revisión: B, Archivo publicado: jun 1, 1997
Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
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Designing With Logic (Rev. C)
PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
PDF, 43 Kb, Archivo publicado: abr 1, 1996
Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

Linea modelo

Serie: 74ACT16623 (3)

74ACT16623DL 74ACT16623DLG4 74ACT16623DLR

Clasificación del fabricante

Semiconductors > Logic > Buffer/Driver/Transceiver > Standard Transceiver