Datasheet Texas Instruments 5962-8852201SA — Ficha de datos
Fabricante | Texas Instruments |
Serie | SN54AS808B |
Numero de parte | 5962-8852201SA |
Hexagonal de 2 entradas y controladores 20-CDIP -55 a 125
Hojas de datos
Hex 2-Input And Drivers datasheet
PDF, 608 Kb, Revisión: C, Archivo publicado: enero 1, 1995
Extracto del documento
Precios
Estado
Estado del ciclo de vida | Obsoleto (El fabricante ha interrumpido la producción del dispositivo) |
Disponibilidad de muestra del fabricante | No |
Embalaje
Pin | 20 |
Package Type | J |
Industry STD Term | CDIP |
JEDEC Code | R-GDIP-T |
Width (mm) | 6.92 |
Length (mm) | 24.2 |
Thickness (mm) | 4.57 |
Pitch (mm) | 2.54 |
Max Height (mm) | 5.08 |
Mechanical Data | Descargar |
Paramétricos
Input Type | TTL |
Operating Temperature Range(C) | -55 to 125 |
Output Type | TTL |
Package Group | CDIP |
Package Size: mm2:W x L (PKG) | See datasheet (CDIP) |
Rating | Military |
Schmitt Trigger | No |
Technology Family | AS |
VCC(Max)(V) | 5.5 |
VCC(Min)(V) | 4.5 |
tpd @ Nom Voltage(Max)(ns) | 6.5 |
Plan ecológico
RoHS | Desobediente |
Pb gratis | No |
Notas de aplicación
- Input and Output Characteristics of Digital Integrated CircuitsPDF, 1.7 Mb, Archivo publicado: oct 1, 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou - Advanced Schottky (ALS and AS) Logic FamiliesPDF, 1.9 Mb, Archivo publicado: agosto 1, 1995
This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t - TI IBIS File Creation Validation and Distribution ProcessesPDF, 380 Kb, Archivo publicado: agosto 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con - Advanced Schottky Load ManagementPDF, 277 Kb, Archivo publicado: feb 1, 1997
Designers of high-speed systems that include advanced Schottky (AS) devices must consider the operating environment in their work. They must be aware of the individual device characteristics and their interaction with other devices. This document provides a detailed discussion of the waveform characteristics equivalent circuit models transmission line fanout and termination for AS load manageme - Live InsertionPDF, 150 Kb, Archivo publicado: oct 1, 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Mb, Archivo publicado: mayo 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a - Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Kb, Archivo publicado: jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Designing With Logic (Rev. C)PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w - Introduction to LogicPDF, 93 Kb, Archivo publicado: abr 30, 2015
Linea modelo
Serie: SN54AS808B (6)
- 5962-88522012A 5962-8852201RA 5962-8852201SA SN54AS808BJ SNJ54AS808BFK SNJ54AS808BJ
Clasificación del fabricante
- Semiconductors > Space & High Reliability > Logic Products > Gate Products
Otros nombres:
59628852201SA, 5962 8852201SA