Datasheet Texas Instruments 74ACT11374DWR — Ficha de datos

Fabricante	Texas Instruments
Serie	74ACT11374
Numero de parte	74ACT11374DWR

Chanclas O-Type de tipo D activadas por borde con salidas de 3 estados 24-SOIC -40 a 85

Hojas de datos

Descargar

PDF, 826 Kb, Revisión: A, Archivo publicado: abr 1, 1996

Extracto del documento

Precios

Estado

Estado del ciclo de vida	Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricante	No

Embalaje

Pin	24
Package Type	DW
Industry STD Term	SOIC
JEDEC Code	R-PDSO-G
Package QTY	2000
Carrier	LARGE T&R
Device Marking	ACT11374
Width (mm)	7.5
Length (mm)	15.4
Thickness (mm)	2.35
Pitch (mm)	1.27
Max Height (mm)	2.65
Mechanical Data	Descargar

Paramétricos

3-State Output	Yes
Bits	8
F @ Nom Voltage(Max)	90 Mhz
ICC @ Nom Voltage(Max)	0.08 mA
Operating Temperature Range	-40 to 85 C
Output Drive (IOL/IOH)(Max)	24/-24 mA
Package Group	SOIC
Package Size: mm2:W x L	24SOIC: 160 mm2: 10.3 x 15.5(SOIC) PKG
Rating	Catalog
Schmitt Trigger	No
Technology Family	ACT
VCC(Max)	5.5 V
VCC(Min)	4.5 V
Voltage(Nom)	5 V
tpd @ Nom Voltage(Max)	13 ns

Plan ecológico

RoHS

Obediente

Notas de aplicación

Descargar
Selecting the Right Level Translation Solution (Rev. A)
PDF, 313 Kb, Revisión: A, Archivo publicado: jun 22, 2004
Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
Descargar
TI IBIS File Creation Validation and Distribution Processes
PDF, 380 Kb, Archivo publicado: agosto 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
Descargar
Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
Descargar
Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
PDF, 337 Kb, Archivo publicado: jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
Descargar
Introduction to Logic
PDF, 93 Kb, Archivo publicado: abr 30, 2015
Descargar
Implications of Slow or Floating CMOS Inputs (Rev. D)
PDF, 260 Kb, Revisión: D, Archivo publicado: jun 23, 2016
Descargar
CMOS Power Consumption and CPD Calculation (Rev. B)
PDF, 89 Kb, Revisión: B, Archivo publicado: jun 1, 1997
Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
Descargar
Power-Up Behavior of Clocked Devices (Rev. A)
PDF, 34 Kb, Revisión: A, Archivo publicado: feb 6, 2015
Descargar
Designing With Logic (Rev. C)
PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
Descargar
Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
PDF, 43 Kb, Archivo publicado: abr 1, 1996
Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

Linea modelo

Serie: 74ACT11374 (4)

74ACT11374DBLE 74ACT11374DW 74ACT11374DWG4 74ACT11374DWR

Clasificación del fabricante

Semiconductors > Logic > Flip-Flop/Latch/Register > D-Type Flip-Flop