Datasheet Texas Instruments 5962-9758601QSA — Ficha de datos

Fabricante	Texas Instruments
Serie	SN54F244
Numero de parte	5962-9758601QSA

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Plan ecológico

Notas de aplicación

• Descargar
  Input and Output Characteristics of Digital Integrated Circuits
  PDF, 1.7 Mb, Archivo publicado: oct 1, 1996
  This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
• Descargar
  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Kb, Archivo publicado: agosto 29, 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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  Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
  PDF, 105 Kb, Revisión: A, Archivo publicado: agosto 1, 1997
  The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
• Descargar
  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Kb, Revisión: C, Archivo publicado: dic 2, 2015
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  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Kb, Archivo publicado: jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  Designing With Logic (Rev. C)
  PDF, 186 Kb, Revisión: C, Archivo publicado: jun 1, 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
• Descargar
  Introduction to Logic
  PDF, 93 Kb, Archivo publicado: abr 30, 2015

Linea modelo

Clasificación del fabricante

• Semiconductors > Space & High Reliability > Logic Products > Buffers/Drivers/Transceivers > Buffer Drivers

Otros nombres:

59629758601QSA, 5962 9758601QSA