Datasheet Texas Instruments LMR61428XMMX/NOPB — Ficha de datos

Fabricante	Texas Instruments
Serie	LMR61428
Numero de parte	LMR61428XMMX/NOPB

Hojas de datos

Precios

Estado

Embalaje

Paramétricos

Plan ecológico

Kits de diseño y Módulos de evaluación

• Evaluation Modules & Boards: LMR61428XMMEVM
  LMR61428 Evaluation Module
  Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  
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Notas de aplicación

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  AN-643 EMI/RFI Board Design (Rev. B)
  PDF, 742 Kb, Revisión: B, Archivo publicado: mayo 3, 2004
  Application Note 643 EMI/RFI Board Design
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  Working With Boost Converters
  PDF, 159 Kb, Archivo publicado: jun 15, 2015
  This brief note highlights some of the more common pitfalls when using boost regulators. These includemaximum achievable output current and voltage, short circuit behavior and basic layout issues. It isassumed that the reader is familiar with the basic operation of a boost regulator.
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  Input and Output Capacitor Selection
  PDF, 219 Kb, Archivo publicado: sept 19, 2005
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  Basic Calculation of a Boost Converter's Power Stage (Rev. C)
  PDF, 186 Kb, Revisión: C, Archivo publicado: enero 8, 2014
  This application note gives the equations to calculate the power stage of a boost converter built with an IC with integrated switch and operating in continuous conduction mode. It is not intended to give details on the functionality of a boost converter (see Reference 1) or how to compensate a converter. See the references at the end of this document if more detail is needed.
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  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, Revisión: A, Archivo publicado: abr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
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  AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
  PDF, 1.4 Mb, Revisión: A, Archivo publicado: abr 23, 2013
  This application note provides thermal power analysis techniques for analyzing the power IC.
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  AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
  PDF, 2.7 Mb, Revisión: A, Archivo publicado: abr 23, 2013
  This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
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  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, Revisión: C, Archivo publicado: abr 19, 2016
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  AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
  PDF, 82 Kb, Revisión: C, Archivo publicado: abr 23, 2013
  When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
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  Understanding Boost Power Stages In Switchmode Power Supplies
  PDF, 149 Kb, Archivo publicado: marzo 4, 1999
  A switching power supply consists of the power stage and the control circuit. The power stage performs the basic power conversion from the input voltage to the output voltage and includes switches and the output filter. This report addresses the boost power stage only and does not cover control circuits. The report includes detailed steady-stage and small-signal analysis of the boost power stage o
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  AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
  PDF, 374 Kb, Revisión: C, Archivo publicado: abr 23, 2013
  This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
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  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, Revisión: C, Archivo publicado: abr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
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  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, Revisión: B, Archivo publicado: abr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Linea modelo

Clasificación del fabricante

• Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Up (Boost) > Boost Converter (Integrated Switch)