Datasheet Texas Instruments 74LVTH322374ZKER — Ficha de datos

Fabricante	Texas Instruments
Serie	SN74LVTH322374
Numero de parte	74LVTH322374ZKER

Flip-Flop tipo D de 32 bits ABT de 32 bits activado por borde con salidas de 3 estados 96-LFBGA -40 a 85

Hojas de datos

Descargar

PDF, 704 Kb, Revisión: C, Archivo publicado: nov 13, 2006

Extracto del documento

Precios

Estado

Estado del ciclo de vida	Activo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricante	No

Embalaje

Pin	96
Package Type	ZKE
Industry STD Term	BGA MICROSTAR
JEDEC Code	R-PBGA-N
Package QTY	1000
Carrier	LARGE T&R
Device Marking	HW374
Width (mm)	5.5
Length (mm)	13.5
Thickness (mm)	.85
Pitch (mm)	.8
Max Height (mm)	1.4
Mechanical Data	Descargar

Paramétricos

3-State Output	Yes
Bits	32
F @ Nom Voltage(Max)	160 Mhz
ICC @ Nom Voltage(Max)	10 mA
Operating Temperature Range	-40 to 85 C
Output Drive (IOL/IOH)(Max)	12/-12 mA
Package Group	LFBGA
Package Size: mm2:W x L	96LFBGA: 74 mm2: 5.5 x 13.5(LFBGA) PKG
Rating	Catalog
Schmitt Trigger	No
Technology Family	LVT
VCC(Max)	3.6 V
VCC(Min)	2.7 V
Voltage(Nom)	3.3 V
tpd @ Nom Voltage(Max)	5.3 ns

Plan ecológico

RoHS

Obediente

Notas de aplicación

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Bus-Hold Circuit
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TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
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The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
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Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
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PDF, 150 Kb, Archivo publicado: oct 1, 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
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Input and Output Characteristics of Digital Integrated Circuits
PDF, 1.7 Mb, Archivo publicado: oct 1, 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
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Power-Up Behavior of Clocked Devices (Rev. A)
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Linea modelo

Serie: SN74LVTH322374 (1)

74LVTH322374ZKER

Clasificación del fabricante

Semiconductors > Logic > Flip-Flop/Latch/Register > D-Type Flip-Flop