Datasheet Texas Instruments TMP108AIYFFR — Ficha de datos
Fabricante | Texas Instruments |
Serie | TMP108 |
Numero de parte | TMP108AIYFFR |
Sensor de temperatura con capacidad de 1.4V ± 0.75 ° C con función de alerta de ventana e I2C / SMBus en WCSP 6-DSBGA -40 a 125
Hojas de datos
Low-Power Digital Temperature Sensor with Two-Wire Interface in WCSP datasheet
PDF, 803 Kb, Archivo publicado: abr 18, 2013
Extracto del documento
Precios
Estado
Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) |
Disponibilidad de muestra del fabricante | Sí |
Embalaje
Pin | 6 |
Package Type | YFF |
Industry STD Term | DSBGA |
JEDEC Code | R-XBGA-N |
Package QTY | 3000 |
Carrier | LARGE T&R |
Device Marking | T8 |
Thickness (mm) | .535 |
Pitch (mm) | .4 |
Max Height (mm) | .625 |
Mechanical Data | Descargar |
Paramétricos
Addresses | 4 |
Interface | I2C, SMBus, 2-Wire |
Iq(Typ) | 6 uA |
Local Sensor Accuracy(Max) | 0.75 +/- C |
Operating Temperature Range | -40 to 125 C |
Package Group | DSBGA |
Package Size: mm2:W x L | See datasheet (DSBGA) PKG |
Rating | Catalog |
Special Features | Programmable Alert,Fault Queue,One-Shot Conversion,Window Comparator,Shutdown |
Supply Current(Max) | 6 uA |
Supply Current(Typ) | 6 uA |
Supply Voltage(Max) | 3.6 V |
Supply Voltage(Min) | 1.4 V |
Temp Resolution(Max) | 12 bits |
Plan ecológico
RoHS | Obediente |
Kits de diseño y Módulos de evaluación
- Evaluation Modules & Boards: TMP108EVM
TMP108EVM - Evaluate TMP108 Digital Temperature Sensor with Two-Wire Interface in WCSP
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
Notas de aplicación
- Temperature sensors: PCB guidelines for surface mount devices (Rev. A)PDF, 5.6 Mb, Revisión: A, Archivo publicado: enero 18, 2019
Power hungry electronic components such as CPUs GPUs or FPGAs as well as voltage regulators heat up during operation. Some applications require ambient air temperature measurements while others need to measure the temperature of a nearby component on the PCB. Measuring ambient air temperature with a surface mount technology (SMT) device is challenging due to the thermal influence of other compo - AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AG)PDF, 13.7 Mb, Revisión: AG, Archivo publicado: agosto 12, 2015
- Understanding the I2C BusPDF, 124 Kb, Archivo publicado: jun 30, 2015
Linea modelo
Serie: TMP108 (2)
- TMP108AIYFFR TMP108AIYFFT
Clasificación del fabricante
- Semiconductors > Sensing Products > Temperature Sensors > Local Digital Temperature Sensors