Datasheet Texas Instruments 74AVC16244DGGRE4 — Ficha de datos

FabricanteTexas Instruments
SerieSN74AVC16244
Numero de parte74AVC16244DGGRE4
Datasheet Texas Instruments 74AVC16244DGGRE4

Memoria intermedia / controlador de 16 bits con salidas de 3 estados 48-TSSOP -40 a 85

Hojas de datos

SN74AVC16244 datasheet
PDF, 831 Kb, Revisión: N, Archivo publicado: jul 21, 2004
Extracto del documento

Precios

Estado

Estado del ciclo de vidaActivo (Recomendado para nuevos diseños)
Disponibilidad de muestra del fabricante

Embalaje

Pin48
Package TypeDGG
Industry STD TermTSSOP
JEDEC CodeR-PDSO-G
Package QTY2000
CarrierLARGE T&R
Device MarkingAVC16244
Width (mm)6.1
Length (mm)12.5
Thickness (mm)1.15
Pitch (mm).5
Max Height (mm)1.2
Mechanical DataDescargar

Paramétricos

Bits16
F @ Nom Voltage(Max)200 Mhz
ICC @ Nom Voltage(Max)0.04 mA
Operating Temperature Range-40 to 85 C
Output Drive (IOL/IOH)(Max)-12/12 mA
Package GroupTSSOP
Package Size: mm2:W x L48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) PKG
RatingCatalog
Schmitt TriggerNo
Technology FamilyAVC
VCC(Max)3.6 V
VCC(Min)1.2 V
Voltage(Nom)1.2,1.5,1.8,2.5,3.3 V
tpd @ Nom Voltage(Max)3.1,3.3,2.9,1.9,1.7 ns

Plan ecológico

RoHSObediente

Kits de diseño y Módulos de evaluación

  • Evaluation Modules & Boards: ADS5232EVM
    ADS5232 Dual-Channel, 12-Bit, 65-MSPS Analog-to-Digital Converter Evaluation Module
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • Evaluation Modules & Boards: ADC08060EVM
    ADC08060 8-Bit 60MSPS 1.3mW/MSPS ADC With Internal Sample and Hold Evaluation Module
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • Evaluation Modules & Boards: ADC08200EVM
    ADC08200 8-Bit 200MSPS Low-Power ADC With Internal Sample and Hold Evaluation Module
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • Evaluation Modules & Boards: ADS5231EVM
    ADS5231 Dual-Channel, 12-Bit, 40-MSPS Analog-to-Digital Converter Evaluation Module
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
  • Evaluation Modules & Boards: ADC08100EVM
    ADC08100 8-Bit 100MSPS 1.3mW/MSPS Analog-to-Digital Converter (ADC) Evaluation Module
    Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)

Notas de aplicación

  • Simultaneous-Switching Performance of TI Logic Devices (Rev. B)
    PDF, 378 Kb, Revisión: B, Archivo publicado: feb 23, 2005
    Simultaneous-switching noise can generate and propagate glitches in electronic systems. Therefore, system designers are faced with challenges to minimize simultaneous-switching noise, while increasing switching speed and improving signal quality. This report presents the performance of different TI logic devices under various simultaneous-switching conditions. Factors such as the number of bits sw
  • Dynamic Output Control (DOC) Circuitry Technology And Applications (Rev. B)
    PDF, 126 Kb, Revisión: B, Archivo publicado: jul 7, 1999
    Texas Instruments (TI[TM]) next-generation logic is called the Advanced Very-low-voltage CMOS (AVC) family. The AVCfamily features TI?s Dynamic Output Control (DOC[TM]) circuit (patent pending). DOC circuitry automatically lowers the outputimpedance of the circuit at the beginning of a signal transition, providing enough current to achieve high signaling speeds, thensubsequently raises the i
  • AVC Logic Family Technology and Applications (Rev. A)
    PDF, 148 Kb, Revisión: A, Archivo publicado: agosto 26, 1998
    Texas Instruments (TI?) announces the industry?s first logic family to achieve maximum propagation delays of less than 2 ns at 2.5 V. TI?s next-generation logic is the Advanced Very-low-voltage CMOS (AVC) family. Although optimized for 2.5-V systems, AVC logic supports mixed-voltage systems because it is compatible with 3.3-V and 1.8-V devices. The AVC family features TI?s Dynamic Output Control (
  • Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B)
    PDF, 390 Kb, Revisión: B, Archivo publicado: abr 30, 2015
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, Revisión: B, Archivo publicado: mayo 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, Revisión: A, Archivo publicado: jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati

Linea modelo

Clasificación del fabricante

  • Semiconductors > Logic > Buffer/Driver/Transceiver > Non-Inverting Buffer/Driver