Datasheet Texas Instruments MSP430F2274MDATEP — Ficha de datos
| Fabricante | Texas Instruments |
| Serie | MSP430F2274-EP |
| Numero de parte | MSP430F2274MDATEP |
Microcontrolador de ultra baja potencia de 16 bits, 32kB Flash, 1K RAM 38-TSSOP -55 a 125
Hojas de datos
Mixed Signal Microcontroller. datasheet
PDF, 1.4 Mb, Revisión: D, Archivo publicado: mayo 18, 2011
Extracto del documento
Precios
Estado
| Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) |
| Disponibilidad de muestra del fabricante | Sí |
Embalaje
| Pin | 38 |
| Package Type | DA |
| Industry STD Term | TSSOP |
| JEDEC Code | R-PDSO-G |
| Package QTY | 250 |
| Carrier | SMALL T&R |
| Device Marking | M430F2274MEP |
| Width (mm) | 6.2 |
| Length (mm) | 12.5 |
| Thickness (mm) | 1.15 |
| Pitch (mm) | .65 |
| Max Height (mm) | 1.2 |
| Mechanical Data | Descargar |
Paramétricos
| ADC | ADC10 - 12ch |
| AES | N/A |
| Active Power | 270 uA/MHz |
| Additional Features | Watchdog,OpAmp,Temp Sensor,Brown Out Reset |
| BSL | UART |
| CPU | MSP430 |
| Frequency | 16 MHz |
| GPIO | 32 |
| I2C | 1 |
| Max VCC | 3.6 |
| Min VCC | 1.8 |
| Multiplier | N/A |
| Non-volatile Memory | 32 KB |
| Operating Temperature Range | -55 to 125 C |
| Package Group | TSSOP |
| Package Size: mm2:W x L | 38TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) PKG |
| RAM | 1 KB |
| Rating | HiRel Enhanced Product |
| SPI | 1 |
| Special I/O | N/A |
| Standby Power | 0.7 LPM3-uA |
| Timers - 16-bit | 2 |
| UART | 1 |
| Wakeup Time | 1 us |
Plan ecológico
| RoHS | Obediente |
Kits de diseño y Módulos de evaluación
- Evaluation Modules & Boards: EZ430-RF2500-SEH
MSP430 Solar Energy Harvesting Development Tool
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños) - JTAG Emulators/ Analyzers: ENERGYTRACE
MSP EnergyTrace Technology
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
Notas de aplicación
- Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)PDF, 237 Kb, Revisión: E, Archivo publicado: mayo 4, 2018
This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430 - General Oversampling of MSP ADCs for Higher Resolution (Rev. A)PDF, 551 Kb, Revisión: A, Archivo publicado: abr 1, 2016
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
Linea modelo
Serie: MSP430F2274-EP (4)
- MSP430F2274MDATEP MSP430F2274MRHATEP V62/08631-01XE V62/08631-01YE
Clasificación del fabricante
- Semiconductors > Space & High Reliability > Microcontroller > Low Power MCU > MSP430 MCU