Datasheet Texas Instruments MSP430F2618TGQWTEP — Ficha de datos
Fabricante | Texas Instruments |
Serie | MSP430F2618-EP |
Numero de parte | MSP430F2618TGQWTEP |
Producto mejorado MCU de ultra baja potencia de 16 bits, 92 KB de memoria flash, 8 KB de RAM, ADC de 12 bits, DAC dual, 2 USCI 113-BGA MICROSTAR JUNIOR -40 a 105
Hojas de datos
Mixed Signal Microcontroller datasheet
PDF, 1.2 Mb, Archivo publicado: dic 15, 2008
Extracto del documento
Precios
Estado
Estado del ciclo de vida | Activo (Recomendado para nuevos diseños) |
Disponibilidad de muestra del fabricante | Sí |
Embalaje
Pin | 113 |
Package Type | GQW |
Industry STD Term | BGA MICROSTAR JUNIOR |
JEDEC Code | S-PBGA-N |
Package QTY | 250 |
Carrier | SMALL T&R |
Device Marking | F2618GQWEP |
Width (mm) | 7 |
Length (mm) | 7 |
Thickness (mm) | .74 |
Pitch (mm) | .5 |
Max Height (mm) | 1 |
Mechanical Data | Descargar |
Paramétricos
ADC | ADC12 - 8ch |
AES | N/A |
Active Power | 365 uA/MHz |
Additional Features | Watchdog,DAC,Temp Sensor,Brown Out Reset |
BSL | UART |
CPU | MSP430 |
Comparators | Yes |
DMA | 3 |
Frequency | 16 MHz |
GPIO | 48 |
I2C | 2 |
Max VCC | 3.6 |
Min VCC | 1.8 |
Multiplier | 16x16 |
Non-volatile Memory | 116 KB |
Operating Temperature Range | -40 to 105 C |
Package Group | BGA MICROSTAR JUNIOR |
Package Size: mm2:W x L | 113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR) PKG |
RAM | 8 KB |
Rating | HiRel Enhanced Product |
SPI | 2 |
Special I/O | N/A |
Standby Power | 0.5 LPM3-uA |
Timers - 16-bit | 2 |
UART | 2 |
Wakeup Time | 1 us |
Plan ecológico
RoHS | See ti.com |
Kits de diseño y Módulos de evaluación
- JTAG Emulators/ Analyzers: ENERGYTRACE
MSP EnergyTrace Technology
Estado del ciclo de vida: Activo (Recomendado para nuevos diseños)
Notas de aplicación
- Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)PDF, 237 Kb, Revisión: E, Archivo publicado: mayo 4, 2018
This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430 - General Oversampling of MSP ADCs for Higher Resolution (Rev. A)PDF, 551 Kb, Revisión: A, Archivo publicado: abr 1, 2016
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
Linea modelo
Serie: MSP430F2618-EP (2)
- MSP430F2618TGQWTEP V62/09620-01XA
Clasificación del fabricante
- Semiconductors > Space & High Reliability > Microcontroller > Low Power MCU > MSP430 MCU